{"id":16835,"date":"2025-06-25T12:29:48","date_gmt":"2025-06-25T10:29:48","guid":{"rendered":"https:\/\/quantum.com.pl\/?post_type=product&p=16835"},"modified":"2025-06-26T11:39:02","modified_gmt":"2025-06-26T09:39:02","slug":"oxy5335a-2","status":"publish","type":"product","link":"https:\/\/quantum.com.pl\/en\/product\/oxy5335a-2\/","title":{"rendered":"OXY5335A"},"content":{"rendered":"

Specifications:<\/h3>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
Operating Temp.<\/strong><\/th>\n<\/th>\n<\/tr>\n
-40\u00b0C to 85\u00b0C<\/td>\n<\/td>\n<\/tr>\n
System<\/strong><\/th>\n<\/th>\n<\/tr>\n
CPU Type<\/td>\nIntel\u00ae<\/sup> Ivy Bridge 22nm Core™ i7\/i5\/i3 BGA Type<\/p>\n

Intel\u00ae<\/sup> Core™ i7-3517UE (2C x 1.7 GHz), 4M L2 cache (17W)<\/p>\n

Intel\u00ae<\/sup> Core™ i5-3610ME (2C x 2.7 GHz), 3M L2 cache (35W)<\/p>\n

Intel\u00ae<\/sup> Core™ i3-3217UE (2C x 1.66 GHz), 3M L2 cache (17W)<\/td>\n<\/tr>\n

Chipset<\/td>\nIntelR QM77 Express Chipset (IntelR BD82QM77 PCH)<\/td>\n<\/tr>\n
Memory Type<\/td>\n1 x 204-pin SO-DIMM DDR3 1333\/1600 MHz up to 8 GB<\/td>\n<\/tr>\n
BIOS<\/td>\nAMI\u00ae<\/sup> UEFI BIOS<\/td>\n<\/tr>\n
Watchdog<\/td>\n1-255 sec. or 1-255 min. software programmable<\/td>\n<\/tr>\n
Expansion Slot<\/strong><\/th>\n<\/th>\n<\/tr>\n
Mini PCIe<\/td>\n1 x miniPCIe for Gen2<\/td>\n<\/tr>\n
mSATA<\/td>\n1 x mSATA for Gen2<\/td>\n<\/tr>\n
Display<\/strong><\/th>\n<\/th>\n<\/tr>\n
Chipset<\/td>\nIntel\u00ae<\/sup> HD Grapics 4000 Integrated Graphics Engine<\/td>\n<\/tr>\n
VGA<\/td>\nYes (Max. resolution 2048 x 1536 @ 60Hz)<\/td>\n<\/tr>\n
LVDS<\/td>\nDual Channel 24-bit LVDS<\/td>\n<\/tr>\n
Display Type<\/td>\nVGA, LVDS, DVI-I<\/td>\n<\/tr>\n
Audio<\/strong><\/th>\n<\/th>\n<\/tr>\n
Codec<\/td>\nRealtek ALC887 High Definition Audio Codec<\/td>\n<\/tr>\n
Ethernet<\/strong><\/th>\n<\/th>\n<\/tr>\n
Chipset<\/td>\n1 x Intel\u00ae<\/sup> 82579LM & 1 x Intel\u00ae<\/sup> 82574L GbE LAN
\n(support 10\/100\/1000 Mbps for 2 x RJ45 ports)<\/td>\n<\/tr>\n
WOL<\/td>\nYes<\/td>\n<\/tr>\n
Boot from LAN<\/td>\nYes for PXE<\/td>\n<\/tr>\n
Rear I\/O<\/strong><\/th>\n<\/th>\n<\/tr>\n
VGA<\/td>\n1 x 15-pin VGA connector (female<\/td>\n<\/tr>\n
DVI-I<\/td>\n1 x 29-pin DVI-I connector (female)<\/td>\n<\/tr>\n
Ethernet<\/td>\n2 x RJ45 ports (support 10\/100\/1000 Mbps for 2 x RJ45 ports)<\/td>\n<\/tr>\n
COM<\/td>\n1 x RS232\/422\/485<\/td>\n<\/tr>\n
<\/td>\nSerial Signals<\/strong><\/p>\n

RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-<\/p>\n

RS422: TX-, RX+, TX+, RX-, GND<\/p>\n

RS485: DATA-, DATA+, GND<\/td>\n<\/tr>\n

USB<\/td>\n2 x USB 3.0<\/td>\n<\/tr>\n
Internal I\/O<\/strong><\/th>\n<\/th>\n<\/tr>\n
SATA<\/td>\n2 x SATAIII (6 Gb\/s)<\/td>\n<\/tr>\n
USB<\/td>\n8 x USB 2.0 ports by pin header<\/td>\n<\/tr>\n
COM<\/td>\n3 x COM ports<\/p>\n

COM 1, 3, 4 ports support RS232 by pin header<\/td>\n<\/tr>\n

Audio<\/td>\nMic-in, Line-in, Line-out<\/td>\n<\/tr>\n
FAN<\/td>\n1 x CPU fan<\/td>\n<\/tr>\n
LVDS<\/td>\n30-pin connector<\/td>\n<\/tr>\n
PS\/2<\/td>\n1 x 8-pin header<\/td>\n<\/tr>\n
Parellel Port<\/td>\n2 x 13-pin header<\/td>\n<\/tr>\n
DIO<\/td>\n8-bit (4 in\/4 out)<\/td>\n<\/tr>\n
SIM card holder<\/td>\n1<\/td>\n<\/tr>\n
OS support list<\/strong><\/th>\n<\/th>\n<\/tr>\n
Windows<\/td>\nWindows 7 x32\u3001Windows 7 x64<\/td>\n<\/tr>\n
Linux<\/td>\nUbuntu 14.04<\/td>\n<\/tr>\n
Mechanical and Environment<\/strong><\/th>\n<\/th>\n<\/tr>\n
Form Factor<\/td>\n3.5″ SBC<\/td>\n<\/tr>\n
Power Type<\/td>\n12V DC-in, 4-pin ATX power connector, AT\/ATX mode support<\/td>\n<\/tr>\n
Dimension<\/td>\n146 x 102 mm (5.7″ x 4″)<\/td>\n<\/tr>\n
Operating Temp.<\/td>\n-20\u00b0C to 70\u00b0C<\/td>\n<\/tr>\n
Storage Temp.<\/td>\n-40\u00b0C to 85\u00b0C<\/td>\n<\/tr>\n
Relative Humidity<\/td>\n10% to 90%, non-condensing<\/td>\n<\/tr>\n
TEST STANDARD<\/strong><\/th>\n<\/th>\n<\/tr>\n
MIL-STD-810G<\/td>\n<\/td>\n<\/tr>\n
Temperature Shock<\/td>\nMIL-STD-810G Test Method 503.5 Temperature Shock Procedure I-C \/ Storage (Multi-cycle shocks from constant extreme temperature, Form 85\u2103 to -40\u2103, Three cycle)<\/td>\n<\/tr>\n
High Temperature<\/td>\nMIL-STD-810G Test Method 501.5 high Temp ( 96 hours @75\u2103 non-operating + 72 hours @ 75\u2103 operating )<\/td>\n<\/tr>\n
Low Temperature<\/td>\nMIL-STD-810G Test Method 502.5 Low Temp ( 96 hours @ -40\u2103 non-operating +72 hours @ -40\u2103 operating )<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

<\/h3>\n

Ordering Information<\/h3>\n

OXY5335A-ET-3517UE<\/strong>\u00a0 \u00a0 \u00a03.5″ SBC Intel\u00ae Ivy Bridge Processor (Mobile) BGA CPU,
\nMulti-Display by DVI-I, VGA, LVDS, Dual Intel\u00ae GbE LAN, +12V DC-in (Core™ i7-3517UE) (-20 to 70\u00b0C)<\/p>\n

OXY5335A-ET-3217UE<\/strong>\u00a0 \u00a0 \u00a03.5″ SBC Intel\u00ae Ivy Bridge Processor (Mobile) BGA CPU,
\nMulti-Display by DVI-I, VGA, LVDS, Dual Intel\u00ae GbE LAN, +12V DC-in(Core™ i3-3217UE ) (-20 to 70\u00b0C)<\/p>\n

OXY5335A-UT-3517UE\u00a0 \u00a0 \u00a0<\/strong>3.5″\u00a0SBC Intel\u00ae Ivy Bridge Processor (Mobile) BGA CPU,
\nMulti-Display by DVI-I, VGA, LVDS, Dual Intel\u00ae GbE LAN, +12V DC-in (Core™ i7-3517UE) (-40 to 85\u00b0C optional)<\/p>\n

OXY5335A-UT-3217UE<\/strong>\u00a0 \u00a0 \u00a03.5″ SBC Intel\u00ae Ivy Bridge Processor (Mobile) BGA CPU,
\nMulti-Display by DVI-I, VGA, LVDS, Dual Intel\u00ae GbE LAN, +12V DC-in (Core™ i3-3217UE) (-40 to 85\u00b0C optional)<\/p>\n","protected":false},"excerpt":{"rendered":"

\n
\n

3.5″ SBC Intel\u00ae<\/sup> Ivy Bridge Processor (Mobile) BGA CPU (i7\/i5\/i3), Multi-Display by DVI-D, VGA, LVDS, Dual Intel\u00ae<\/sup> GbE LAN, +12V DC-in, -40\u00b0C to 85\u00b0C<\/strong><\/p>\n<\/div>\n

\n
    \n
  • Intel\u00ae<\/sup> Ivy Bridge BGA CPU + Intel QM77 PCH<\/li>\n
  • Multi display: VGA, DVI-I, LVDS<\/li>\n
  • 4 COM, 10 USB, 2 LAN<\/li>\n
  • 2 SATAIII and HD Audio<\/li>\n
  • 1 x Full-size miniPCIe and 1 x mSATA<\/li>\n
  • Onboard SIM Card slot for 3.5G connectivity<\/li>\n
  • Extended operating temperature. -40\u00b0C to 85\u00b0C<\/li>\n<\/ul>\n<\/div>\n

    Introduction<\/strong><\/h4>\n

    \"New-product-page_new_03_02\"OXY5335A is a highly integrated 3.5\u201d rugged SBC driven by Intel\u00ae<\/sup> 3rd generation Ivy Bridge CPU and chipset soldering onboard. Processor i7-3517UE plus Intel\u00ae<\/sup> QM77 chipset supports dual-core ULV 1.7 GHz, consuming only 17W and 4.1W individually. The powerful combination makes the SBC with high computing power for multi-tasking while reducing idle power consumption. Mission-critical applications can take the advantages of processors soldering onboard and extended operating temperature from -40 to 85\u00b0C to ensure ultimate durability, utmost resistance to shock & vibration. OXY5335A is truly a rugged SBC ideal for high-end Automation, heavy-duty railway, drilling and energy applications.<\/p>\n<\/div>\n

    \n

    Thermal solution for fanless system design<\/strong><\/h4>\n

    Heat sinks are used to cool down device temperature by dissipating heat into surrounding air. Since the configurations and the power circuit placement of each model are different, which will lead to different extent of heat generation; therefore PERFECTRON designs tailor-made heat sink for each motherboard. Special high and low fin design forms a wind-flow to reduce thermal resistance. Moreover, cross section wave line on the interface increases up to 30-40% air contact area. Combining these two features, thermal performance leverages to utmost. The option of fan is also available to the customers if fanless design is not necessary.<\/p>\n

    Advanced cooling solution for better heat dissipation<\/strong><\/h4>\n

    To meet the demands of customer\u2019s extended temperature requirements, the whole thermal solution of OXY5335A simultaneously embraces two heat transfer methods, heat conduction and heat convection. For heat conduction, the solution utilizes a copper heat spreader on the bottom layer which directly contact with the processor and chipset. Heat is then transferred to upper aluminum heat sink. Regarding to heat convection, the temperature differences caused by high and low fin design forms a mild airflow that could bring away heat efficiently. Fan can also be an auxiliary by placing an appropriate sized fan on top of the heat sink. Breakdown drawing is provided as below.<\/p>\n

    Installation Instruction<\/strong><\/h4>\n

    Procedure: Stick thermal pad on CPU and chipset, and then simply put passive heat sink on thermal pad.<\/p>\n

    Copper heat spreader is used to contact with CPU and chipset directly to absorb heat efficiently on the bottom layer, and then spread the collected heat to upper aluminum heat sink. While aluminum is used to force heat convection. After heat spreader transfer heat from bottom layer to heat sink, High and low fin design plus wave line create airflow to dissipate heat.<\/p>\n

    Aluminum Passive Heat Sink<\/strong>
    \nHeat sink is known for lowering the temperature by dissipating heat into the surrounding air. Though copper absorbs faster, it doesn\u2019t dissipate faster than aluminum.
    \n\u2022It contains 96 % of aluminum, 30.8 mm height and weighs 321 g
    \n\u2022High and low fin design plus wave line increase contact surface up to 30-40% and create airflow.
    \n\u2022Consume shorter heat dissipating time owing to lower metal density
    \n\u2022Better performance in heat dissipating<\/p>\n

    Copper Flat Heat Spreader<\/strong>
    \nHeat spreader is known for improving the distribution of heat. According to metal characteristics, copper has better heat absorption performance than aluminum. That is why copper is chosen to be heat spreader.
    \n\u2022It contains 99.9 % purity of copper, 5.5 mm height and weighs 326 g
    \n\u2022Absorb heat quicker than aluminum owing to higher heat conductivity coefficient (copper 402: aluminum 266)
    \n\u2022Better performance in heat absorbing<\/p>\n

    Synergies of copper heat spreader plus aluminum heat sink:<\/strong>
    \n\u201cCopper absorbs heat faster; aluminum dissipates heat faster\u201d
    \nPossessing the physical knowledge and expertise about metal characteristics accomplish the perfect match of thermal solution.<\/p>\n

    Operating Temp.<\/strong>
    \nCan with stand extended temperature from -40\u00b0C to 85\u00b0C<\/p>\n<\/div>\n","protected":false},"featured_media":16842,"template":"","meta":{"_acf_changed":false,"inline_featured_image":false,"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0},"product_brand":[],"product_cat":[566,510],"product_tag":[],"class_list":{"0":"post-16835","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-35-sbc-en","7":"product_cat-perfectron-en","9":"first","10":"instock","11":"shipping-taxable","12":"product-type-simple"},"acf":[],"_links":{"self":[{"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product\/16835","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/media\/16842"}],"wp:attachment":[{"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/media?parent=16835"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product_brand?post=16835"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product_cat?post=16835"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product_tag?post=16835"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}