The PIP40 Product Family is a high performance, low power and highly integrated Rugged Embedded Computer, based in the latest Intel technology. The solution is available in a compact aluminum housing with DIN-Rail or flange, a rugged MIL IP67 enclosure, a 19\u201d rack system or an open frame solution with a cooling plate. All configurable depending on your application or needs. The unique chassis solutions allows to operate the PIP40 product range in a moderate as well as in harsh environments. The design integrates standard connectors for easy connection or lockable headers, depending on housing choice or needs.<\/p>\n
The PIP housings offer sufficient space for 2.5\u201d SSD or other expansions like UPS, RAID..). Two mPCIe and three m.2 slots allow to expand the system very easy. The internal expansion bus allows to integrate PCIe\/104 or PCIe cards. These expansion possibilities give a maximum on customization for additional interfaces and features. Particular precautions during the design have been taken that the entire system EMC is within the CE and FCC limits and standards like EN50155, IEC 60945 or MIL-STD-810 can be met.<\/p>\n
* depending on selected CPU<\/i> The PIP40 Family has been designed to withstand any harsh environments and extreme temperature conditions. The special rugged design, combined with the best industrial-grade components, offer high reliability and long-term performance. The PIP40 Family is available for different Industries and is the perfect embedded computer solution for industrial environments, railway applications, MIL\/COTS, SWaP-C applications, or whenever a rugged long-term available computer is needed.<\/p>\nTechnical Features<\/h4>\n
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Dane og\u00f3lne<\/strong><\/td>\n<\/tr>\n| <\/td> | PIP41R<\/strong><\/td> | PIP44R<\/strong><\/td> | PIP46R<\/strong><\/td> | PIP46<\/strong><\/td> | PIP49R <\/strong><\/td> | additional CPUs are available | \n(IOTG roadmap)<\/span><\/td>\n<\/tr>\n Procesor<\/td> | Celeron G4930E<\/td> | Intel i3-9100HL<\/td> | Intel i7-9850HE<\/td> | Intel i7-8850H<\/td> | Xeon E-2276ME<\/td>\n<\/tr>\n | # of cores \/ threads<\/td> | 2 \/ 2<\/td> | 4 \/ 4<\/td> | 6 \/ 12<\/td> | 6 \/ 12<\/td> | 6 \/ 12<\/td>\n<\/tr>\n | Clock speed<\/td> | 2.4 GHz<\/td> | 1.6 \/ 2.9 GHz<\/td> | 2.7 \/ 4.4 GHz | \n<\/td> 2.6 \/ 4.3 GHz<\/td> | 2.8 \/ 4.5 GHz<\/td>\n<\/tr>\n | Passmark<\/td> | 2624<\/td> | 6354<\/td> | 12258<\/td> | 10551<\/td> | 14397<\/td>\n<\/tr>\n | L2 Cache<\/td> | 2 MB<\/td> | 6 MB<\/td> | 9 MB<\/td> | 9 MB<\/td> | 12 MB<\/td>\n<\/tr>\n | TDP<\/td> | 35W<\/td> | 25W<\/td> | 45W<\/td> | 45W<\/td> | 45W<\/td>\n<\/tr>\n | Chipset<\/td> | Intel CM246<\/td>\n<\/tr>\n | Memory<\/td> | 2x dual-channel ECC DDR4 SODIMM slot, supports up to 32GB modules (total board memory 64GB*) | \n(PIP46 DDR4 only, no ECC)<\/td>\n<\/tr>\n BIOS<\/td> | On-board soldered 32MB Flash, MPL engineered BIOS (AMI), customizable<\/td>\n<\/tr>\n | TPM<\/td> | Trusted Platform Support TPM 2.0<\/td>\n<\/tr>\n | Watchdog Timer<\/td> | Configurable granularity 1-255 sec. or 1-255 min.<\/td>\n<\/tr>\n | Indicator LEDs<\/td> | Power, HDD, LAN<\/td>\n<\/tr>\n | Mass Storage<\/strong><\/td>\n<\/tr>\n | SATA<\/td> | 2x SATA 3.0 ports<\/td>\n<\/tr>\n | mSATA<\/td> | 2x mSATA Full-Mini Card combo socket with SATA 3.0 & USB 2.0<\/td>\n<\/tr>\n | m.2<\/td> | 1x NVMe or SATA SSD<\/td>\n<\/tr>\n | RAID<\/td> | RAID 0\/1\/5\/10 on SATA or mSATA (Intel RST)<\/td>\n<\/tr>\n | Interfaces<\/strong><\/td>\n<\/tr>\n | Graphics Interfaces<\/td> | Display Port (DP) up to 4096x2160 (DP) and DVI-D (LVDS \/ eDP up to 1920 x 1200 optional) | \nTriple display capable, ESD protected. Gen3 PCIe port x16 (PEG) for graphic card<\/td>\n<\/tr>\n USB<\/td> | 8x USB 3.1 ports, supports USB keyboards and mice as legacy devices | \n4x additional internal USB2.0 ports<\/td>\n<\/tr>\n LAN<\/td> | AMT \/ vPro support*, optional up to 5 LAN ports<\/td>\n<\/tr>\n | Porty szeregowe | \n<\/td> Internal 4x full modem TTL (optional RS232 or RS422\/485 ports on DB9 connectors)<\/td>\n<\/tr>\n | HDAudio<\/td> | Intel HDAudio signals, available on a 1 mm header, sound card (HDSOUND-1) is available<\/td>\n<\/tr>\n | Expansions<\/strong><\/td>\n<\/tr>\n | mPCIe<\/td> | 2x mPCIe PCI Express Gen3, x1 lane & USB 2.0 (combined with mSATA)<\/td>\n<\/tr>\n | m.2<\/td> | 2x communication slot (1x Key-A, PCIe\/USB 2.0 & 1x Key-B, USB 3.x\/PCIe\/SATA), dual SIM connector<\/td>\n<\/tr>\n | PCIe\/104<\/td> | 1x PCIe\/104 slot (4x PCIe x1 lane, x16 PEG port, 2x USB 2.0)<\/td>\n<\/tr>\n | Power <\/strong><\/td>\n<\/tr>\n | Input Voltage<\/td> | 10 - 36 VDC input range, ESD and EMC protected power input (optionally up to 110VDC) | \nProtection against: reverse polarity, up to 150V load dump \nCombinded power button and ignition input, specifically for vehicles<\/td>\n<\/tr>\n Power consumption<\/td> | 5-100 Watt (Enhanced Intel Speed Step Technology)<\/td>\n<\/tr>\n | Environment <\/strong><\/td>\n<\/tr>\n | Storage Temperature<\/td> | -45\u00b0C up to +85\u00b0C (-49\u00b0F to +185\u00b0F)<\/td>\n<\/tr>\n | Operating Temperature<\/td> | -20\u00b0C up to +60\u00b0C (-4\u00b0F to +140\u00b0F)<\/td>\n<\/tr>\n | Ext. Temp. (optional)<\/td> | -40\u00b0C up to +65\u00b0C (-40\u00b0F to +149\u00b0F)<\/td>\n<\/tr>\n | Relative Humidity<\/td> | 5% to 95% non condensing, optional coating available<\/td>\n<\/tr>\n | Standard Compliance<\/strong> | \n<\/td>\n<\/tr>\n The PIP40 Family is designed to meet or exceed the most common standards. Particular references are:<\/td>\n<\/tr>\n | EMC<\/td> | EN 55022, EN 55024, EN 61000, | \nMIL-STD-461 \n - Conducted Emissions (CE101, CE102, CE103), \n - Conducted Susceptibility (CS101, CS103, CS104, CS105, CS109, CS114, CS115, CS116), \n - Radiated Emissions (RE101, RE102, RE103), \n - Radiated Susceptibility (RS101, RS103, RS105), \n<\/td>\n<\/tr>\n Shock & Vibration<\/td> | EN 60068<\/td>\n<\/tr>\n | Environmental & Safety<\/td> | EN 50155, EN 60601, EN 60950, | \nMIL-STD-810 \n - Method 500 Low Pressure (Altitude) \n - Method 501 High Temperature \n - Method 502 Low Temperature \n - Method 503 Temperature Shock \n - Method 504 Contamination by Fluids \n - Method 505 Solar Radiation (Sunshine) \n - Method 506 Rain (Wind\/Blown Rain) \n - Method 508 Fungus \n - Method 509 Salt Fog \n - Method 510 Sand and Dust \n - Method 511 Explosive Atmosphere \n - Method 512 Leakage \n - Method 513 Acceleration \n - Method 514 Vibration \n - Method 515 Acoustic Noise \n - Method 516 Shock \n - Method 519 Gunfire Vibration \n - Method 520 Temp, Humidity, Vibration<\/td>\n<\/tr>\n Approval List<\/td> | CE, IEC 60945, IACS E10<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n * <\/em>depending on selected CPU<\/i><\/p>\n | Packaging<\/h4>\n\n
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