<\/p>\n
The SR10B based on Intel\u00ae Haswell QM87 chipset, is powered by Intel\u00ae 4th generation Core™ i7\/i5\/i3 processor onboard. The SR10B can operate effectively in harsh environment under temp range from -40 to 70\u00b0C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR10B is based on EBX form factor, Swissbit XR-DIMM up to 8GB. It supports triple-display, 2 DP and 1 DVI-I, 4 GIGA LAN port, 4 USB 3.0 and 4 COM port. SR10B supplies wide power voltage from 9 to 36V DC-in.<\/p>\n
SR10B is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. What\u2019s more to make the system more rugged is SR10B designed with EBX form factor and stackable ability. With those two features can provide maximum exceeding solidity when stacking together to prevent loose from vibration. With key components- CPU and SSD soldering on board to enhance the capability of shock and vibration. With unique Wipe Rope Vibration Isolator design, the level of vibration resistance increased.<\/p>\n
STACKRACK has especially design a Wire Rope Vibration Isolator for SR10B. The Wire Rope Vibration Isolator may sustain higher vibration resistance of the product itself. A Wire Rope Vibration Isolator is widely apply on supporting Military equipment because it may absorb and protect the object from vibration damage in any axes simultaneously, with the protection it may extended the product life operating under long hour vibration environment and vibration shock. The isolator is long life maintenance free tool and it may unload whenever required. Besides, Wipe Rope Vibration Isolators may survive under extreme temperature, corrosion, radioactivity, extreme dry or high humidity and UV Radiation environment.<\/p>\n
<\/p>\n
<\/p>\n
(1) Intel\u00ae Core i7 CPU soldering onboard<\/strong><\/p>\n OXY5737A is based on EBX rugged single board computer, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard. With processor soldering on board can enhance the resistance of shock and vibration to allow product operates under every possible condition. With processor solder on board would lower resistance and inductance at the connection enhance effective transmission that could guarantee better and more high frequency performance for the system.<\/p>\n (2) 2.5″ SATA Easy Storage Accessible Tray<\/strong><\/p>\n Easy Storage Accessible Tray allow customer to access the Storage without disassemble the system. It may let the user remove, replace and carry out the HDD easily. With this feature, SR10 may widely apply in surveillance, data storage and infotainment purpose due to occasionally or daily storage reload is required.<\/p>\n (3) Wide range DC input from 9V~ 36V<\/strong><\/p>\n For certain application such like transportation and military always challenge the risk of unstable power that might cause damage to the system. Wide range DC input becomes an indispensable element for those applications. SR10A supports Wide range 9V~ 36V DC-in to protect system from damage caused by sudden surge or peak voltage. This feature guarantees the system increasing migration path flexible and eliminates redesign of existing power architecture.<\/p>\n <\/p>\n\n Intel\u00ae QM87 MIL-STD Fanless Rugged Vibration Proof System with Intel\u00ae Core™ i7 Haswell Processor, SSD easy swap cage, mPCIe expansion 9V to 36V DC-in, Wide Temp. -40 ~ 70\u00b0C<\/p>\n","protected":false},"featured_media":11095,"template":"","meta":{"_acf_changed":false,"inline_featured_image":false,"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0},"product_brand":[],"product_cat":[510,1592,534],"product_tag":[],"class_list":{"0":"post-4564","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-perfectron-en","7":"product_cat-rugged-computers","8":"product_cat-rugged-computing-systems","10":"first","11":"instock","12":"shipping-taxable","13":"product-type-simple"},"acf":[],"_links":{"self":[{"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product\/4564","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/media\/11095"}],"wp:attachment":[{"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/media?parent=4564"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product_brand?post=4564"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product_cat?post=4564"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product_tag?post=4564"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}\n\n
\n\t Model<\/strong><\/th> <\/td> OXY5535B-UT<\/strong>
\n<\/th>\n<\/tr>\n<\/thead>\n\n\n\t Temperatura operacyjna<\/td> <\/td> -40\u00b0C ~ +85\u00b0C
\n<\/td>\n<\/tr>\n\n\t System<\/td> Typ CPU<\/td> Intel\u00ae Ivy Bridge, typ FCBGA1023
\nCore\u2122 i3 3217UE (2C x 1.6GHz), 3M L2 cache (17W)
\nCore\u2122 i7 3517UE (2C x 1.7GHz), 4M L2 cashe (17W)
\nCeleron 1047UE (1.4GHz), 2M L2 cache (17W)<\/td>\n<\/tr>\n\n\t <\/td> Chipset<\/td> Intel\u00ae QM77
\n<\/td>\n<\/tr>\n\n\t <\/td> Typ pami\u0119ci<\/td> 1 x DDR3 1333\/1600 MHz XR-DIMM z ECC do 8 GB<\/td>\n<\/tr>\n \n\t <\/td> BIOS<\/td> AMI\u00ae UEFI BIOS
\n<\/td>\n<\/tr>\n\n\t <\/td> Zegar nadzoruj\u0105cy<\/td> 1-255 sek. lub 1-255 min. programowalny software
\n<\/td>\n<\/tr>\n\n\t Gniazdo rozszerze\u0144<\/td> StackPC<\/td> 1<\/td>\n<\/tr>\n \n\t <\/td> FPE<\/td> 1<\/td>\n<\/tr>\n \n\t Obraz<\/td> Chipset<\/td> Zintegrowany GFX w procesorze Ivy Bridge
\n<\/td>\n<\/tr>\n\n\t <\/td> VGA<\/td> 1<\/td>\n<\/tr>\n \n\t <\/td> DVI-D<\/td> 1<\/td>\n<\/tr>\n \n\t <\/td> LVDS<\/td> Dwukana\u0142owy 24-bitowy LVDS
\n<\/td>\n<\/tr>\n\n\t <\/td> Typ obrazu<\/td> VGA + LVDS
\n<\/td>\n<\/tr>\n\n\t Audio<\/td> Codec<\/td> Realtek ALC887 High Definition Audio Codec
\n<\/td>\n<\/tr>\n\n\t Ethernet<\/td> Chipset<\/td> Intel\u00ae 82579LM & 82574IT GbE
\n<\/td>\n<\/tr>\n\n\t Wewn\u0119trzne I\/O<\/td> SATA<\/td> 2 x SATAIII (6 Gb\/s)
\n<\/td>\n<\/tr>\n\n\t <\/td> Dysk flash NAND
\n<\/td>Onbaord 32 GB MLC
\n<\/td>\n<\/tr>\n\n\t <\/td> USB 2.0<\/td> 4<\/td>\n<\/tr>\n \n\t <\/td> COM<\/td> 4 (2x RS232, 2x RS422\/485)
\n<\/td>\n<\/tr>\n\n\t <\/td> VGA<\/td> Z\u0142\u0105cze 1 na 1 x 10-stykowe (maks. Rozdzielczo\u015b\u0107 SXGA 2048 x 1536 @ 60 Hz)
\n<\/td>\n<\/tr>\n\n\t <\/td> LVDS<\/td> Z\u0142\u0105cze 1 na 1 x 30-stykowe
\n<\/td>\n<\/tr>\n\n\t <\/td> Inverter<\/td> Z\u0142\u0105cze 1 na 1 x 5-stykowe
\n<\/td>\n<\/tr>\n\n\t <\/td> DVI-D<\/td> Z\u0142\u0105cze 1 na 1 x 30-stykowe (maks. Rozdzielczo\u015b\u0107 1920 x 1080)
\n<\/td>\n<\/tr>\n\n\t <\/td> DIO<\/td> 8-bit (4 wej\u015bcia \/ 4 wyj\u015bcia bez izolacji)
\n<\/td>\n<\/tr>\n\n\t <\/td> PS\/2<\/td> Z\u0142\u0105cze 1 na 1 x 6-stykowe
\n<\/td>\n<\/tr>\n\n\t <\/td> FAN<\/td> 1<\/td>\n<\/tr>\n \n\t <\/td> Mechanika i \u015brodowisko<\/strong><\/td> <\/td>\n<\/tr>\n \n\t Form Factor
\n<\/td><\/td> PCIe\/104 (StackPC)
\n<\/td>\n<\/tr>\n\n\t Typ mocy<\/td> <\/td> Wej\u015bcie 12V DC, 4-stykowe z\u0142\u0105cze zasilania ATX, obs\u0142uga trybu AT \/ ATX
\n<\/td>\n<\/tr>\n\n\t Wymiary<\/td> <\/td> 95.89 x 115.57 mm (3.8\" x 4.6\")
\n<\/td>\n<\/tr>\n\n\t Temperatura operacyjna<\/td> <\/td> -40\u00b0C do 85\u00b0C
\n<\/td>\n<\/tr>\n\n\t Temperatura przechowywania<\/td> <\/td> -40\u00b0C do 85\u00b0C
\n<\/td>\n<\/tr>\n\n\t Wzgl\u0119dna wilgotno\u015b\u0107<\/td> <\/td> 10% do 90%, bez kondensacji
\n<\/td>\n<\/tr>\n\n\t <\/td> Testy zgodno\u015bci<\/strong><\/td> <\/td>\n<\/tr>\n \n\t <\/td> Szok temperaturowy
\n<\/td>MIL-STD-810G Metoda badawcza 503.5 Procedura szoku termicznego I-C \/ Przechowywanie (Szoki wielocyklowe od sta\u0142ej ekstremalnej temperatury, od 85 \u2103 do -40 \u2103, trzy cykle)
\n<\/td>\n<\/tr>\n\n\t MIL-STD-810G<\/td> Wysoka temperatura<\/td> Metoda testowa MIL-STD-810G wysoka temperatura 501,5 (96 godzin przy 75 \u2103 bez dzia\u0142ania + 72 godziny przy 75 \u2103 podczas pracy)
\n<\/td>\n<\/tr>\n\n\t <\/td> Niska temperatura<\/td> MIL-STD-810G Metoda badawcza 502,5 Niska temperatura (96 godzin przy -40\u2103 bez dzia\u0142ania +72 godziny przy -40\u2103 podczas pracy)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n","protected":false},"excerpt":{"rendered":"