<\/p>\n
PER535A, a system made with convenience and strength in mind, is powered by Perfectron\u2019s INS8335C high performance motherboard. PER535A can thrive at +70\u2103 without processor throttling and continually presents superior 2.3 GHz clock speed. Flexible expansion slot design features 1 x PCI & PCIe slot. 16 bit DIO can meet the needs of various different applications, such automation, energy exploration, medical and defence. Wide range DC in put design with ATX power supply from 9V to 24V can protect the system from sudden current fluctuation. For applications that require extreme resistance to shock and vibration, PER535A has passed IEC 60068-2-64& IEC 60068-2-27 vibration and shock tests. In an effort to permanently vanquish the malfunction due to crash and collision, PER535A is equipped with four rubber foot stands at the front side to prevent possible damages to I\/O and power switch. With industrial grade handles assembled on two sides of the system, easy installation and utmost mobility are warranted.<\/p>\n
<\/p>\n
INS8335A, with its dynamic 4-core 45W core i7-3610QE processor, demands an equal high level thermal solution. To achieve maximum heat dissipation, the design and implementation of heat pipes is the golden key. In this case, a copper heat sink and passively cooled enclosure is implemented to establish an effective dissipation environment. The structure of four pure copper heat pipes is to ensure supreme thermal efficiency. The heat pipes are capable of prompt dissipation of the heat generated by the CPU\u2019s inner core while it\u2019s computing. According to Perfectron\u2019s testing result, each pure copper heat pipe has the ability to dissipate 9w of heat. The combination of four heat pipes pushes the dissipation ability to a new level. Our tailor-made, precision-aimed integral structural heat sink and embedded heat pipes constitute an excellent fanless thermal solution. When the CPU hits 100% full potency, the implementation of four 6mm (minimum) pure copper heat pipes can keep it running at full speed \u2013 2.3 Ghz!<\/p>\n
Perfectron\u2019s unique heat sink and heat pipe are designed with precision. Each of the key heat-dissipating components is tailor-made in accordance with different interior and exterior structure. Unlike traditional solutions that utilize aluminum as the dissipating media for CPU and fin. We insist on incorporating 99% pure copper heat spreader, which is eight times higher in density than aluminum. Our tailor-made pure copper heat spreader is treated with the most precise CNC technology, cutting four 6.1mm wide track so that the 6mm wide heat pipes can fit seamlessly. Compared with conventional solid heat conductors, such as aluminum, copper, granite, and graphite, of which thermal conductivity ranges from only 250 W\/m\u2022K to 1,500 W\/m\u2022K, Perfectorn\u2019s effective heat pipe design, with impressively high thermal conductivity (5000 W\/m\u2022K to 200000 W\/m\u2022K) that is 40 times higher than standard aluminum, is guaranteed to charge the system to the maximum turbo speed with minimum overall impact.<\/p>\n
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<\/p>\n
1. Ever powerful Intel Core i7 CPU<\/strong><\/p>\n Rugged system demands an even stronger heart to pump it through all types of tough applications. Powered intel i7 CPU, both the computing power and the rugged ability are tightly secured.<\/p>\n 2. Industrial handles meet ergonomic design<\/strong><\/p>\n By placing two industrial grade, extremely reliable handles on the side, the system can be installed and moved with ease.<\/p>\n 3. Rubber Foot Stands Design<\/strong><\/p>\n Four rubber foot stands are installed in the front to protect front I\/O and power switch from collision.<\/p>\n 4. Comprehensive thermal design<\/strong><\/p>\n PER535A incorporates four pure copper heat pipes and a copper & aluminum passive heat spreader. On the two sides of the system are aluminum heat sinks to push the dissipation ability to a complete new level.<\/p>\n 5. Supreme resistance to shock & vibration (IEC compliant)<\/strong><\/p>\n The ability to withstand high level of shock and vibration is guaranteed through EC 60068-2-64& IEC 60068-2-27 vibration and shock tests.<\/p>\n Intel\u00ae Ivy Bridge QM77 with Ivy Bridge core i7\/i5\/i3 Processor Fanless Rugged System, 9V to 24V DC-in, Extended Temperature. -40 to 70\u00b0C<\/p>\n","protected":false},"featured_media":11079,"template":"","meta":{"_acf_changed":false,"inline_featured_image":false,"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0},"product_brand":[],"product_cat":[716,1586,510],"product_tag":[],"class_list":{"0":"post-5543","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-box-pc-2","7":"product_cat-compact-computers-box-pc","8":"product_cat-perfectron-en","10":"first","11":"instock","12":"shipping-taxable","13":"product-type-simple"},"acf":[],"_links":{"self":[{"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product\/5543","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/media\/11079"}],"wp:attachment":[{"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/media?parent=5543"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product_brand?post=5543"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product_cat?post=5543"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/quantum.com.pl\/en\/wp-json\/wp\/v2\/product_tag?post=5543"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}Technical data:<\/h4>\n\n
\n\n
\n\t Operating Temp.\t<\/strong><\/th> <\/td> -20\u00b0C ~ +50\u00b0C \n
\n<\/th>\n<\/tr>\n<\/thead>\n\n\t System<\/strong><\/td> CPU<\/td> Intel\u00ae Core\u2122 Skylake-S
\nIntel\u00ae Core i3-6100TE (2C x 2.7 GHz), 4M Cache (35W)
\nIntel\u00ae Core i5-6500TE (4C x 2.3\/3.3 GHz), 6M Cache (35W)
\nIntel\u00ae Core i7-6700TE (4C x 2.4\/3.4 GHz), 8M Cache (35W)<\/td>\n<\/tr>\n\n\t Chipset<\/td> Intel\u00ae Q170 Chipset
\n
\n<\/td>\n<\/tr>\n\n\t GPU<\/td> AMD E8860\/ NVIDIA M2000
\n
\n<\/td>\n<\/tr>\n\n\t Memory Type<\/td> 2 x DDR4 SO-DIMM up to 32 GB
\n<\/td>\n<\/tr>\n\n\t Expansion Slot\t
\n<\/td>1 x mPCIe with SIM card holder
\n
\n<\/td>\n<\/tr>\n\n\t Storage Device<\/td> 2 x 2.5\" HDD\/SSD trays
\n1 x M.2 (Type 2280) SSD<\/td>\n<\/tr>\n\n\t Ethernet Chipset<\/td> Intel\u00ae I-211AT & I-219LM GbE
\n<\/td>\n<\/tr>\n\n\t Front I\/O\t<\/strong><\/td> Power Button<\/td> 1<\/td>\n<\/tr>\n \n\t Indicator LED<\/td> 1 x HDD LED
\n1 x Power LED<\/td>\n<\/tr>\n\n\t 2.5\" HDD\/SSD Tray\t<\/td> 2<\/td>\n<\/tr>\n \n\t Rear I\/O\t<\/strong><\/td> Power Input<\/td> 1 x IEC C14 Plug
\n<\/td>\n<\/tr>\n\n\t DisplayPort<\/td> 2 x DP++ connector (female), resolution up to 4096 x 2304@60 Hz
\n<\/td>\n<\/tr>\n\n\t HDMI<\/td> 1 x HDMI1.4b connector (female), resolution up to 4096 x 2304@24 Hz
\n<\/td>\n<\/tr>\n\n\t Ethernet<\/td> 2 x RJ45 ports
\n<\/td>\n<\/tr>\n\n\t Audio<\/td> Mic-in, Line-out
\n<\/td>\n<\/tr>\n\n\t COM<\/td> 2 x RS232
\n1 x RS-232\/422\/485 ports, select under BIOS (DB9 male)
\n
\n<\/td>\n<\/tr>\n\n\t Serial Signals
\n<\/strong><\/td>\n<\/tr>\n\n\t RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-
\n
\nRS422: TX-, RX+, TX+, RX-, GND
\n
\nRS485- 4W: TxD+, TxD-, RxD+, RxD-, GND
\n
\nRS485- 2W: DATA-, DATA+, GND<\/td>\n<\/tr>\n\n\t USB<\/td> 4 x USB 3.0
\n<\/td>\n<\/tr>\n\n\t Audio<\/td> Mic-in, Line-out
\n<\/td>\n<\/tr>\n\n\t Display\t<\/strong><\/td> Display Interface<\/td> HDMI interface x 1:HDMI connectors (female); resolution up to 4096 x 2304@24 Hz<\/td>\n<\/tr>\n \n\t Graphics Controller<\/td> Onboard Intel\u00ae HD Graphics 500 Series
\n<\/td>\n<\/tr>\n\n\t OS support list\t<\/strong><\/td> Windows<\/td> Windows 7 x32\/ x64\u3001Windows 8.1 x32\/ x64\u3001Windows 10 x32\/ x64
\n<\/td>\n<\/tr>\n\n\t Linux<\/td> Fedora 15, Ubuntu, Red Hat
\n<\/td>\n<\/tr>\n\n\t Mechanical and Environment
\n<\/strong><\/td>Power Requirement<\/td> 90V to 264V AC-in, AT\/ATX
\n<\/td>\n<\/tr>\n\n\t Dimension<\/td> 440 x 420 x 44 mm
\n<\/td>\n<\/tr>\n\n\t Weight<\/td> 6.0 kg
\n<\/td>\n<\/tr>\n\n\t Operating Temp.<\/td> -20 to 50\u00b0C(ambient with air flow)
\n<\/td>\n<\/tr>\n\n\t Storage Temp.<\/td> -40 to 85\u00b0C
\n<\/td>\n<\/tr>\n\n\t Relative Humidity<\/td> 5% to 95%, non-condensing
\n<\/td>\n<\/tr>\n\n\t TEST STANDARD
\n<\/strong><\/td>MIL-STD-810G Test<\/td> Method 507.5, Procedure II (Temperature & Humidity)
\nMethod 501.5, Procedure I (Storage\/High Temperature)
\nMethod 501.5, Procedure II (Operation\/High Temperature)
\nMethod 502.5, Procedure I (Storage\/Low Temperature)
\nMethod 502.5, Procedure II (Operation\/Low Temperature)
\nMethod 503.5, Procedure I (Temperature shock)<\/td>\n<\/tr>\n\n\t EMC<\/td> CE, FCC compliant
\n<\/td>\n<\/tr>\n\n\t Green Product<\/td> RoHS, WEEE compliance<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n","protected":false},"excerpt":{"rendered":"