Description
Specifications:
| Networking | 2x 10GBASE-T (10G Ethernet) 2x 1000BASE-T (1G Ethernet) |
| Display | 1x DisplayPort |
| Camera Inputs | 1x 16-Lane MIPI Expansion Connector
Interface directly to a range of MIPI CSI, GMSL2 |
| USB | 1x USB 3.2 Ports (Type-C – OTG Capable), 1x USB 3.2 Ports (Type-C) |
| Storage | 1x Micro SD, 2x NVMe M.2 Key M Slots |
| UART | 2x @ 3.3V levels UART1 and UART2 1x RS-232/485 UART |
| I2C/SPI | 2x I2C Channel @ 3.3V IO 2x SPI Channel @ 3.3V IO |
| CAN | 2x CAN 2.0b Non-Isolated Port |
| GPIO | 4x 3.3V GPI Inputs 6x 3.3V GPO Outputs (2x PWM Capable) 1x 3.3V Power Pin at 1A |
| User Expansion | 1x M.2 Key E 2230 Wifi/BT (PCIe/USB2) 1x M.2 Key B 3042/3052 (LTE/5G – USB3) with Micro SIM |
| Input Power | +10 to 36V DC Wide Input Power (6-pin Mini-fit Jr. Connector) |
| Buttons | Power, Reset, Recovery (Tactile Buttons as well as fine pitch pin header connector) |
| RTC Battery | 3-pin Picoblade connector to accept CTI battery cable assembly |
| PCB/Electronics Mechanical Information | Dimensions: 155mm x 125mm |
| Operating Temperature | -40°C to +85°C (-40°F to +185°F) |
Ordering informations:
AGX201-001 Forge Integrated Assembly with AGX Orin Module, TTP only
AGX201-067 Forge Integrated Assembly with AGX Orin Module, Passive Thermal
AGX201-09A Forge Integrated Assembly with AGX Orin Module, Active Thermal
Cables/Accessories
MSG103 PSU 6pin 12V 250W
XHG319 AGX Orin Active Thermal
XHG320 AGX Orin Passive Thermal
XHG321 Forge 10G PHY TTP
