Description
Specyfications:
| Module Compatibility | Pre-integrated with NVIDIA® Jetson AGX Orin™ Industrial (248 TOPS) |
|---|---|
| GPU | 2048-core NVIDIA® Ampere architecture GPU with 64 Tensor Cores |
| CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU – 3MB L2 + 6MB L3 |
| Memory | 64GB 256-bit LPDDR5 (+ ECC) 204.8GB/s |
| Dimensions | 200mm x 180mm x 125mm (7.87″ x 7.09″ x 4.92″) |
| Video Output | 1x DisplayPort 1.4 Output 4K @ 60HZ |
| Networking | 1x 10GBASE-T Ethernet (10GbE) 1x 2.5GBASE-T Ethernet (2.5GbE) 1x 1000BASE-T Ethernet (1GbE) |
| SDI Camera | 4x 3G-SDI/HD-SDI/SDI Inputs 2x 3G-SDI/HD-SDI/SDI Outputs |
| USB | 2x USB 3.2 Ports (10Gbps Capable) |
| Wireless / Misc Expansion | 1x 4TB NVMe WiFi/BT (optional) |
| Trusted Platform Module (TPM) | SLB9670 TPM2.0 Chipset Hardware TPM Implementation |
| Input Power / Misc Power Details | MIL-STD-704F Input Power +28V Nominal Operating Voltage (+16V to +50V Range as specified by MIL-STD-704F) EMI/EMC as per MIL-STD-461F/G |
| GPIO / Serial Interfaces | 8x 3.3V GPIO (2x PWM capable) 1x 3.3V, 1A Source pin 2x UART (RS232/422/485 configurable) 1x 3.3V I2C 1x 3.3V SPI 2x 3.3V UART 2x CAN |
| Operating Temperature | -40°C to +70°C (-40°F to +158°F) |
| Weight | 2.5 kg |
| MIL Specifications | Environmental: MIL-STD-810H, DO-160H EMC/EMI: MIL-STD-461G, MIL-HDBK-704F, MIL-HDBK-831 |
| Optional MIL-STD 1553B | 1x MIL-STD 1553 |
| Warranty and Support | 1 Year Warranty and Free Technical Support |
Ordering Information:
ESG630 Sentry-X2 MIL-Rugged system (NVIDIA® Jetson AGX Orin™ Industrial)
