Highlights:
- Compatible with Jetson Nano, TX2 NX, and Xavier NX SoMs
- Integrate up to 4x 2-lane or 3x 4-lane MIPI FRAMOS Sensor Modules
- Dual Gigabit Ethernet and Dual USB
- NVMe and microSD card for additional storage
- WiFi and Bluetooth expansion options
- +9V to +36V wide input voltage range
More information:
Boson for FRAMOS is an AI vision powerhouse, integrating up to four MIPI cameras within an extremely small footprint. Specifically designed for use within the FRAMOS Sensor Ecosystem, Boson maximizes sensor inputs and storage solutions for high-end vision applications. This joint product offering provides customers with a plug and play vision solution that accelerates application development time. Compatible with the Jetson Nano, TX2 NX and Xavier NX SoM’s, users can seamlessly transition between modules should their processing needs change.
Boson for FRAMOS comes standard with software hooks in the board support package that automatically connects select cameras in the FRAMOS Sensor Module Ecosystem to NVIDIA’s JetPack SDK, eradicating any further development requirements from your Software team.
Boson for FRAMOS has four FRAMOS PixelMate connectors directly on the carrier board. These connectors allow users to directly connect up to 4x 2-lane or 3x 4-lane MIPI CSI-2 cameras from the FRAMOS Sensor Module Ecosystem.
While Boson for FRAMOS is compatible with NVIDIA Jetson Nano, TX2 NX, and Xavier NX SoMs, some I/O availability will change across modules. View the Boson for FRAMOS Compatibility Specifications for a full breakdown.
Boson is available in a standard SKU (NGX007) and an alternative parts version (NGX017). These are form, fit and function equivalent. Order fulfillment ship dates may differ by part number. See more info here.
Boson for FRAMOS Integration Options
Direct camera integration to the carrier board eliminates the need for an adapter board and decreases the overall hardware stack height. Customers looking for a full stack option can choose to integrate Boson for FRAMOS with their NVIDIA module of choice, available heat sinks, as well as other connectivity options.
Heat Sink Options
Additional Feature Options
- WiFi/Bluetooth additions (through 2230 E-Key Expansion)
- Storage via microSD card
- NVMe storage (through M.2 M-Key (2280) NVMe PCIe x4)
