OXY5363A

Highlights

Intel^® 11th Gen. Tiger Lake-UP3, DDR4 up to 32GB, Dual M.2 expansion slots: 3042/3052/2280 B-key, 2230 E-key, Extended Temp. -40 to 85°C

• 11th Tiger Lake-UP3 i7-1185G7E/i5-1145G7E/i3-1115G4E/Celeron^® 6305E
• Dual M.2 Slots: 1 x M.2 2242/2260/2280 B-key (SATA, PCIe x1), 1x M.2 2230 E-key (PCIe,USB)
• Compatible with M.2 3042/3052 & SIM Slot for 5G Network Connectivity
• 1 x DDR4 SO-DIMM up to 32GB
• 1 x SATA III , 2 x Intel^® Gigabit Ethernet
• 2 x USB 2.0, 4 x USB 3.1
• 4 x COM (3 x RS232, 1 x RS232/422/485)
• 8~24V Wide Voltage Power Input
• Extended Temperature ET : -20 to 70°C ; UT : -40 to 85°C

Introduction

OXY5363A is a highly integrated 3.5″ rugged SBC driven by 11th Gen Intel^® Tiger Lake i7-1185G7E soldering onboard. With processor soldered onboard, OXY5363A can significantly enhance the resistance of vibration and shock. Processor supports graphics (HD Graphics 620 Series) and CPU performance and equips with rich legacy I/O features such as: 2 COM Ports; 8 Bit DIO; 6 USB Ports. With 2 DisplayPort and a Dual Channel 24 Bit LVDS, OXY5363A can fulfill diverse needs of modern day display & monitor control applications.OXY5363A can operate in harsh environment under temperature range from -40℃ to 85 °C and avoid damage from sudden surge of voltage with its 8V to 24V DC input design.

Key Features

(1) Rich I/O interface – Extensive Functionality

Rich I/O design endows OXY5363A with the ability to comprehend present day automation devices, display, and other applications that require extensive I/O features. With 2 COM, 6 USB, 2 LAN, and dual Channel 24-bit LVDS, OXY5363A provides a wide array of choices to expand and connect to different devices

(2) Extended Temperature Operation

7StarLake aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5363A can operate from -40℃ to 85 °C , our strict manufacture procedure guarantees supreme performance in severe environment.

(3) Efficient thermal solution

A tailor-made heat spreader is what 7StarLake provide for engineers to reduce mechanical design period also ensures the highest efficacy for dissipation. For OXY5363A, the customized heat sink is placed on top of the CPU and chipset, acting as the medium that exchanges the heat to the surrounding atmosphere. The highly efficient aluminum heat sink has a thermal conductivity to absorb the heat generated by the pumping CPU.

I/O Placement