Description
Intel® QM87 EBX SBC, Core i7/i5/i3 CPU Haswell & SSD Soldering Onboard, Stackable with StackPC & FPE Expansion, Extended Temperature – 40°C to 85°C
- Intel® Haswell BGA CPU + Intel QM87 PCH
- Stackable expansions: 1 x PCIe_16 (FPE), 4 x PCIe_1 (PCIe/104)
- Onboard XR-DIMM up to 8GB
- Onboard μSSD, compliant with JEDEC MO-276
- Multi displays: 2 x DP, DVI-I, LVDS
- Rich I/O: 6 COM, 6 USB, 2 LAN, 2 SATAIII
- Flexible expansion with 2 x Full-size miniPCIe (one co-lay with mSATA)
- Onboard SIM Card slot for 3.5G connectivity
- Extended operating temperature. -40 to 85°C
OXY5737A, a powerful rugged EBX SBC is driven by Intel® 4th generation Haswell CPU and chipset soldering onboard. Processor i7-4700EQ plus Intel® QM87 chipset supports clock speed 2.4GHz, up to 3.4GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. The powerful combination makes the SBC with high computing power for multi-tasking while reducing idle power consumption. OXY5737A is regarded as a greedy SBC that highly integrates ample I/O on one board to cater various applications usage. Mission-critical applications can take the advantages of key components soldering onboard and extended operating temperature from -40 to 85°C to ensure ultimate durability, utmost resistance to shock & vibration. OXY5737A is truly a rugged SBC ideal for defense, aviation, high-end Automation and heavy-duty railway applications.
Thermal solution for fanless system design
Heat sinks are used to cool down device temperature by dissipating heat into surrounding air. PERFECTRON designs tailor-made heat sink for each motherboard. Special high and low fin design forms a wind-flow to reduce thermal resistance. Moreover, cross section wave line on the interface increases up to 30-40% air contact area. Combining these two features, thermal performance leverages to utmost. OXY5737A has the special design of two budges that are tailor-made based on the heat sources placement of CPU and PCH. With customized heat sink, OXY5737A ensures high reliability and stability while working under wide range temperature from -40 up to 85°C.
Rich I/O for flexibility in I/O configurations
OXY5737A embraces rich I/O that provides embedded system developers diverse flexibility in I/O configurations to meet different embedded applications. The rich I/O features multiple displays, 2 x DP and DVI-I display connectivity ports with dual channel 24-bit LVDS. The outstanding embedded board supports stackable expansion of 1 x PCIe_16 (FPE), 4 x PCIe_1 (PCIe/104) which enable a cable-free board to build an extreme rugged and compact system with more expansion flexibility. This feature-rich board also includes four RS232, two RS232/422/485, six USB ports, two Gigabit LANs, two SATAIII, all these can help system integrators to develop solutions quickly. Viewing the popularity of 3G and touch panel usage, OXY5737A carries onboard SIM Card slot for 3.5G connectivity and onboard Pen Mount 6000 resistive touch controller for connecting touch panel.
Stunning resistance of shock and vibration
OXY5737A has key components soldered onboard to eliminate risk of harm caused by vibration. It not only supports Intel CPU onboard but also memory and storage onboard which drastically enhance the resistance of vibration and shock. The stackable expansion slots, FPE (PCIe_16) and StackPC (PCIe/104) enable to expand more functions by adding on extra cards. The cable-free operation remove the concern about loosen cable connections caused by shock & vibration. Combining critical components soldering onboard and solid PCIe/104 connection, it is also compliant to MIL-STD 810G standard, can withstand 5g vibration, 100g single shocks and 50g multiple shocks.
