Description
Ultra Capacitor Backup for HESC & HPSC
TBP4xxx modules are extended temperature, maintenance free, high cycling backup energy modules that when combined with a Tri-M HESC or HPSC smart charging power solution creates a complete uninterruptable power system (UPS) in a PC/104 footprint. The TBP4xxx designed for hostile environments of extreme temperatures and vibration. This rugged backup energy module is ideal for applications that have either a large number of discharge cycles or where a “maintenance free” solution is required such as remote and hard to access locations.
TBP4xxx Modules are available in 500, 1000, 2000 and 4000 joules and mate directly to the bottom of HESC or HPSC power supplies.
Key Specifications:
- Fully charged in less than a minute
- 500,000 charge cycles
- Deep discharge immune
- Extreme temperature operation
- High altitude capable (info available on request)
- Designed for high vibration and shock environments
- PC/104 size footprint
- Cable free mating with HESC & HPSC
Advantages:
- Designed to MIL Standards
- Prevents loss of data or corruption due to reliable system backup power
- Reduced downtime due to maintenance-free operation
- High Density PC/104 footprint
- Improved reliability due to cable free integration of HESC & HPSC
Applications:
- Military & Civil Vehicles
- Aerospace & Defence
- Industrial Automation
- Telecommunications
- Undersea & Marine
Technical data:
CPU | Intel® Core™ i3-6100 Processor (2 x 3.70 GHz, 3 MB SmartCache, 51 W) Intel® Core™ i5-6500 Processor (4 x 3.20 GHz / 3.60 GHz, 6 MB SmartCache, 65 W) Intel® Core™ i7-6700 Processor (4 x 3.40 GHz / 4.00 GHz, 8 MB SmartCache, 65 W) Intel® Core™ i3-6100TE Processor (2 x 2.70 GHz, 4 MB SmartCache, 35 W) Intel® Celeron® Processor G3900TE (2 x 2.30 GHz, 2 MB SmartCache, 35 W) Intel® Celeron® Processor G3930TE (2 x 2.70 GHz, 2 MB, 35 W) Intel® Core™ i5-6500TE Processor (4 x 2.30 GHz / 3.30 GHz, 6 MB SmartCache, 35 W) Intel® Core™ i7-6700TE Processor (4 x 2.40 GHz / 3.40 GHz, 8 MB SmartCache, 35 W) Intel® Core™ i3-7101TE Processor (2 x 3.40 GHz, 3 MB SmartCache, 35 W) Intel® Core™ i5-7500T Processor (4 x 2.70 GHz / 3.30 GHz, 6 MB SmartCache, 35 W) Intel® Core™ i5-7500 Processor (4 x 3.40 GHz / 3.80 GHz, 6 MB SmartCache, 65 W) Intel® Core™ i7-7700T Processor (4 x 2.90 GHz / 3.80 GHz, 8 MB SmartCache, 35 W) Intel® Core™ i7-7700 Processor (4 x 3.60 GHz / 4.20 GHz, 8 MB SmartCache, 65 W) |
---|---|
Storage Temperature | -20°C to 80°C |
Operating Temperature | 0°C - 60°C |
Power Requirement | ATX power input |
Firmware | AMI UEFI BIOS |
Miscellaneous | System monitor (Voltage, Fan Speed and Temperature) |
Audio | High Definition Audio, Audio Jack on rear I/O with Line-out/ Mic-in |
USB | 4x USB3.0 on rear I/O, 4x USB2.0 on pin header |
Serial Interface | 2x RS-232 on REAR I/O, 4x RS-232 on board 2x20 pin header |
Expansion | 1x PCIe x16, 1x mini-PCIe socket ( support mSATA / USB2.0) |
Network | Realtek 8111H chip, 2x RJ45 connectors on rear I/O |
Storage | Supports two SATAIII ports |
Display Interface | LVDSDual channel 2bit LVDS on board, resolution up to 1920x1200, HDMIOne HDMI port on rear I/O, resolution up to 4K (4096x2160@24Hz), VGAOne VGA port on rear I/O resolutoin up to 1920x1200 @ 60Hz |
Graphic Controller | Intel® Gen 9 Graphics supports DirectX 12, OpenGL 4.2 / OpenCL 2.0, Video decode HW acceleration support for H.264, H.265, MPEG2, VC-1/WMV9, JPEG, VP8, and VP9 |
DRAM | Up to 32GB DDR4-2133 Non-ECC SDRAM on two 260 pin SO-DIMM sockets |
Chipset | Intel® H110 |
Format | Mini-ITX |
Dimensions | 170x170 mm |