Description
Highlights
- COM Express® Type 7 Module Support
- Dual 10-Gigabit Ethernet
- Ultra High Speed Storage with M.2 NVMe SSD support
- Extremely Small Form Factor: 125 x 95mm
- Extended Temperature Range -40°C to +85°C
More Information
Connect Tech’s COM Express® Type 7 Carrier Board is based on the PICMG COM Express® COM.0 R3.0 specification. It includes dual 10-Gigabit Ethernet from SFP+ modules, 2x GbE ports, M.2 NVMe Storage, 4x USB 3.0, full and half size Mini PCIe expansion slots, 8x 3.3V buffered GPIO, and a Console connection via Micro USB. The carrier board is ideal for high-compute, enterprise level applications that have a need for a small form factor rugged solution providing access to high-end Xeon D class processors.
Specifications
Compatibility | COM Express Type 7 Module (PICMG COM Express® COM.0 R3.0), Support for current and next-gen Xeon-D (Broadwell DE) processor modules |
Ethernet | 2 x 10GbE (via SFP+ cages), 2x Gigabit Ethernet (10/100/1000) RJ-45s |
Storage | 1 x M.2 2280 M-Key Slot (Dual function PCIe + SATA) – NVMe (PCIe x4 Gen3) Capable – SATA III (6Gbps) Capable 1 x Standard SATA Port (7-Pin) |
USB | 4x USB 3.0 |
Expansion | 1x mini PCIe slot full size (USB + PCIe), 1x mini PCIe slot half size (USB + PCIe) |
Serial | 1x CPU Console UART (via Micro USB), 1x General Purpose UART (via 2mm header) |
GPIO | 8x 3.3V buffered GPIO |
Power Requirements | +12V Input |
Display Output | None (Headless System) Initial Setup/Debug can be achieved via MiniPCIe graphics module |
Misc | Power Button, Reset Button, Sys Ctr |
Dimensions | 125mm x 95mm |
Weight | 124g (0.27lbs) |
Operating Temperature | -40°C to +85°C (-40°F to +185°F) |