Description
The ADLE3900HDC is the 2nd generation of optimized ADL HDC boards. It is based on Intel’s SoC Atom processors of the E3900 series. Intel’s 9th generation HD graphics engine supports significantly improved processing power and energy efficiency for stunning graphics performance. Even better power management features means that standby power is measured in milliwatts, enabling weeks of standby time. The ADLE3900HDC is a low I/O and low cost version of the ADLE3900HD with M.2 (Type B) 2242 SATA storage and M.2 (Type B) 2280 PCIeX1 expansion.
The powerful new Intel HD Graphics-500/505 engine is capable of simultaneous decode 3x 4k or encode 15x 1080p30 video streams – which makes it an ideal choice for surveillance and other videocentric applications. The graphics output includes: VGA/CRT = 2560×1600@60Hz (via DVI connector), DVI/HDMI/DP (via I-PEX connector), DVI = 1920×1080@60Hz, HDMI = 3840×2160@60Hz, DP = 4096×2160@60Hz. With support for DirectX 12, Open GL 4.4, OpenCL 2.0, and hardware acceleration for H.265/HEVC, VC-1, WMV9, and VP9, Intel’s Apollo Lake SoC Atom processor offers high graphics value and benefits over its predecessor, the Intel Bay Trail.
The ADLE3900HDC has a temperature (Tj) range of -40C to +85C and is ideal for a variety of intelligent controls or gateway applications in harsh, high-temperature environments.
Features:
- CPU: Intel® Atom™ E3900 Processor (Apollo Lake)
- CPU Choice: Quad Core (x7-E3950), Dual Core (x5-E3930)
- Chipset: Intel® SoC
- RAM: Up to 8GB LPDDR4 soldered
- Ordering information:
ITEM CODES | PART# | DESCRIPTION |
---|---|---|
CPU-Boards | ||
ADLE3900HDC-E3930 | tbd. | Intel x5-E3930 Atom Processor; Dual Core, 2x 1.3 GHz, 2MB Cache, 6,5W TDP, 4GB RAM soldered |
ADLE3900HDC-E3950 | tbd. | Intel x7-E3950 Atom Processor; Quad Core, 4x 1.6GHz, 2MB Cache, 12W TDP, 8GB RAM soldered |
Thermal solutions | ||
ADLE3900HDC-SPREADER | tbd. | heat spreader for chassis mount ADLE3900HDC |
ADL35-BBHS | 294152 | large heat sink for ADLXXXHD CPU's |
ADL35-LFAN | 294154 | large fan for ADL35-BBHS |
ADL35-SOSET | 294156 | stand off set for ADL35-BBHS & LFAN |
CS-100 | 290010 | 10"x10" thermal chassis simulator for development |
Options | ||
ADL-ET | 290000 | Extended Temperature Screening (–40C to +85C) |
UNDERFILL | 807707 | BGA underfill req’d for <1nm BGA solderballs w/ Ext Temp |
COATING | 807706 | Conformal Coating |
UNDERFILL/BONDING/COATING | 807709 | Underfilling, Bonding, and Conformal Coating |