Description
Rugged 19″ rack Server Solution MXCS-RK
conductive cooled, with Intel® Xeon™ Processor
The 19″ MXCS Rack Version is a high performance, low power and highly integrated Rugged Embedded Server. The MXCS solution can be operated in a moderate or harsh environment without the need of fans. Therefore, the MXCS board can be used for any server application in very tough and dusty environment.
Highlights
The MXCS housings offer space for up to 8 x 2.5″ SSD. Over PCI/104-Express and mini PCIe are unlimited expansions possible. The 19″ rack server is conductive cooled and designed for an environment of -20°C to +60°C. On request it can be equipped with a failure protected ventilation array, without blowing air and dust over the electronics. The system is designed to meet standards like MIL-STD810, EN50155, or IEC 60945.
Key features are:
- Intel Xeon CPU, up to 16 cores
- Up to 128GB ECC DDR4
- Two 10Gbit ports
- Up to 8x SAS/SATA with RAID configuration
- Conductive cooling concept
The MXCS rugged Server Family has been designed to withstand harsh environments and extreme temperature conditions. The ruggedized design, combined with the best industrial-grade components, offer high reliability and long-term performance.
The MXCS is available for different industries and is the perfect embedded server solution for industrial environments, railway applications, MIL/COTS applications, or whenever a rugged long-term available computer is needed.
Technical features
Dane ogólne | ||||||
PIP41R | PIP44R | PIP46R | PIP46 | PIP49R | additional CPUs are available (IOTG roadmap) |
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Procesor | Celeron G4930E | Intel i3-9100HL | Intel i7-9850HE | Intel i7-8850H | Xeon E-2276ME | |
# of cores / threads | 2 / 2 | 4 / 4 | 6 / 12 | 6 / 12 | 6 / 12 | |
Clock speed | 2.4 GHz | 1.6 / 2.9 GHz | 2.7 / 4.4 GHz | 2.6 / 4.3 GHz | 2.8 / 4.5 GHz | |
Passmark | 2624 | 6354 | 12258 | 10551 | 14397 | |
L2 Cache | 2 MB | 6 MB | 9 MB | 9 MB | 12 MB | |
TDP | 35W | 25W | 45W | 45W | 45W | |
Chipset | Intel CM246 | |||||
Memory | 2x dual-channel ECC DDR4 SODIMM slot, supports up to 32GB modules (total board memory 64GB*) (PIP46 DDR4 only, no ECC) |
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BIOS | On-board soldered 32MB Flash, MPL engineered BIOS (AMI), customizable | |||||
TPM | Trusted Platform Support TPM 2.0 | |||||
Watchdog Timer | Configurable granularity 1-255 sec. or 1-255 min. | |||||
Indicator LEDs | Power, HDD, LAN | |||||
Mass Storage | ||||||
SATA | 2x SATA 3.0 ports | |||||
mSATA | 2x mSATA Full-Mini Card combo socket with SATA 3.0 & USB 2.0 | |||||
m.2 | 1x NVMe or SATA SSD | |||||
RAID | RAID 0/1/5/10 on SATA or mSATA (Intel RST) | |||||
Interfaces | ||||||
Graphics Interfaces | Display Port (DP) up to 4096x2160 (DP) and DVI-D (LVDS / eDP up to 1920 x 1200 optional) Triple display capable, ESD protected. Gen3 PCIe port x16 (PEG) for graphic card |
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USB | 8x USB 3.1 ports, supports USB keyboards and mice as legacy devices 4x additional internal USB2.0 ports |
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LAN | AMT / vPro support*, optional up to 5 LAN ports | |||||
Porty szeregowe | Internal 4x full modem TTL (optional RS232 or RS422/485 ports on DB9 connectors) | |||||
HDAudio | Intel HDAudio signals, available on a 1 mm header, sound card (HDSOUND-1) is available | |||||
Expansions | ||||||
mPCIe | 2x mPCIe PCI Express Gen3, x1 lane & USB 2.0 (combined with mSATA) | |||||
m.2 | 2x communication slot (1x Key-A, PCIe/USB 2.0 & 1x Key-B, USB 3.x/PCIe/SATA), dual SIM connector | |||||
PCIe/104 | 1x PCIe/104 slot (4x PCIe x1 lane, x16 PEG port, 2x USB 2.0) | |||||
Power | ||||||
Input Voltage | 10 - 36 VDC input range, ESD and EMC protected power input (optionally up to 110VDC) Protection against: reverse polarity, up to 150V load dump Combinded power button and ignition input, specifically for vehicles |
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Power consumption | 5-100 Watt (Enhanced Intel Speed Step Technology) | |||||
Environment | ||||||
Storage Temperature | -45°C up to +85°C (-49°F to +185°F) | |||||
Operating Temperature | -20°C up to +60°C (-4°F to +140°F) | |||||
Ext. Temp. (optional) | -40°C up to +65°C (-40°F to +149°F) | |||||
Relative Humidity | 5% to 95% non condensing, optional coating available | |||||
Standard Compliance |
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The PIP40 Family is designed to meet or exceed the most common standards. Particular references are: | ||||||
EMC | EN 55022, EN 55024, EN 61000, MIL-STD-461 - Conducted Emissions (CE101, CE102, CE103), - Conducted Susceptibility (CS101, CS103, CS104, CS105, CS109, CS114, CS115, CS116), - Radiated Emissions (RE101, RE102, RE103), - Radiated Susceptibility (RS101, RS103, RS105), |
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Shock & Vibration | EN 60068 | |||||
Environmental & Safety | EN 50155, EN 60601, EN 60950, MIL-STD-810 - Method 500 Low Pressure (Altitude) - Method 501 High Temperature - Method 502 Low Temperature - Method 503 Temperature Shock - Method 504 Contamination by Fluids - Method 505 Solar Radiation (Sunshine) - Method 506 Rain (Wind/Blown Rain) - Method 508 Fungus - Method 509 Salt Fog - Method 510 Sand and Dust - Method 511 Explosive Atmosphere - Method 512 Leakage - Method 513 Acceleration - Method 514 Vibration - Method 515 Acoustic Noise - Method 516 Shock - Method 519 Gunfire Vibration - Method 520 Temp, Humidity, Vibration |
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Approval List | CE, IEC 60945, IACS E10 |
Packaging
Chassis version | length x width x heights | weight | |
DIN-Rail | 270 x 162 x 63/83/120mm | 2.2 kg (4.85 lb.) with HDD | (custom color or foil available) |
Flange | 290 x 162 x 63/83/120mm | 2.2 kg (4.85 lb.) with HDD | (custom color or foil available) |
IP67 MIL-PIP4x | 324 x 220.5 x 66mm (min.) | (custom housings and connectors available) | |
IP67 MIL-PIP4xS | 266 x 188.5 x 73mm (min.) | (short version) | |
Open Frame | 288 x 177.5 x 33mm (min.) | 1 kg (2.2 lb.) | (custom cooling plate available) |
Open Frame-S | 242 x 177.5 x 33mm (min.) | 0.9 kg (2.0 lb.) | (short version) |
The aluminum housings are internally chromated, externally powder coated or anodized, no ventilation holes. The cooling plate for the open frame versions is chromated. Depopulated versions or solutions with headers can be offered. |