OXY5313A

Description

Intel® Pineview D525 3.5″ SBC, Extended Temperature. -40 to 85°C

• Supports Intel® Atom™ D525 CPU onboard
• Single/dual channel 18/24-bit LVDS
• 1 x Mini PCIe slot
• 5 x COM ports
• 7 x USB ports
• 12V DC-in
• Wide operating temp. -40 to 85°C

OXY5313A is a 3.5” industrial motherboard, driven by Intel® Atom Pineview D525 CPU onboard and ICH8M chipset. Extreme low power consumption of Processor Atom Pineview D525 plus Intel ICH8M chipset is only 13W and 2.4W respectively. Powerful dual-core operation and energy-saving low power design make OXY5313A an ideal candidate for display and automation applications. It supports AC/DC power convert function, which provides a more flexible power selection. VGA & CPU onboard design creates a higher ability to withstand vibration and shock. Extended temperature operation from -40 to +85°C ensures unbeatable reliability. Fast processor equips with rich legacy I/O features such as: 8 COM ports; 8 Bit DIO; 8 x USB; Single 18-bit LVDS. With such extensive functions and powerful computing ability, OXY5313A can fulfill diverse needs of modern day display & monitor control applications.

Rich I/O interface – Extensive Functionality

Rich I/O design endows OXY5313A with the ability to comprehend present day automation, display, and other applications that require extensive I/O features. With 8 COM ports, 8 USB, 2 LAN, 2 SATAII and dual-display (VGA+LVDS), OXY5313A provides a wide array of choices to expand and connect to different devices.

Extended Temperature Operation

PERFECTRON aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5313A can operate from -40 up to 85 degree, our strict manufacture procedure guarantees supreme performance in severe environment.

Efficient thermal solution

Thermal pad and heat sink are used to make up an effective thermal solution. For OXY5313A, the thermal pad is placed on top of the CPU, acting as a supportive medium to dissipate the heat to the surrounding atmosphere. The thermal pad is of the perfect thickness (3mm) to deliver the best performance. An aluminum heat sink is fixed on top of the thermal pad to quick the whole dissipation process.