OXY5315A

Description

3.5” form factor, Intel® Pineview N455 SBC, Extended Temperature. -40 to 85°C

• Intel® Atom Pineview N455 onboard + Intel ICH8M PCH
• Dual independent display: VGA, LVDS
• Rich I/O interface with 8 COM, 8 USB, 2 LAN, 2 SATAII, and 1 x Compact Flash Typell Socket
• Flexible expansion with 1 x miniPCIe
• Support Single/dual Channel 18-bit LVDS
• 12V DC-in, 4-pin ATX power connector, AT/ATX mode support
• Extended operating temperature. -40 to 85°C

OXY5315A is a 3.5” industrial motherboard, driven by Intel® Atom Pineview N455 CPU onboard and ICH8M chipset. Extreme low power consumption of Processor Atom Pineview N455 plus Intel ICH8M chipset is only 6.5W and 2.4W respectively. The overall power consumption is as low as 8.9W! It supports AC/DC power convert function, which provides a more flexible power selection. VGA & CPU onboard design creates a higher ability to withstand vibration and shock. Extended temperature operation from -40 to +85°C ensures unbeatable reliability. Fast processor equips with rich legacy I/O features such as: 8 COM ports; 8 Bit DIO; 8 x USB; optional single/dual channel 18-bit/24-bit LVDS. With such extensive functions and powerful computing ability, OXY5315A can fulfill diverse needs of modern day display & monitor control applications.

Rich I/O interface – Extensive Functionality

Rich I/O design endows OXY5315A with the ability to comprehend present day automation, display, and other applications that require extensive I/O features. With 8 COM ports, 8 USB, 2 LAN, 2 SATAII and dual-display (VGA+LVDS), OXY5315A provides a wide array of choices to expand and connect to different devices.

Extended Temperature Operation

PERFECTRON aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5315A can operate from -40 up to 85 degree, our strict manufacture procedure guarantees supreme performance in severe environment.

Efficient thermal solution

Thermal pad and heat sink are used to make up an effective thermal solution. For OXY5315A, the thermal pad is placed on top of the CPU, acting as a supportive medium to dissipate the heat to the surrounding atmosphere. The thermal pad is of the perfect thickness (3mm) to deliver the best performance. An aluminum heat sink is fixed on top of the thermal pad to quick the whole dissipation process.