OXY5336A

Description

3.5″ SBC, Intel® Ivy Bridge Core i7/i5/i3 CPU onboard, Extended Temperature. -40 to 85°C

• Intel® Ivy Bridge BGA CPU + Intel QM76 PCH
• Multi display: VGA, DVI-I, LVDS
• 4 COM, 10 USB, 2 LAN
• 1 x Full-size miniPCIe and 1 x mSATA
• Onboard SIM Card slot for 3.5G connectivity
• Extended operating temperature. -40 to 85°C

OXY5336A is a highly integrated 3.5” rugged SBC driven by Intel® 3rd generation Ivy Bridge CPU and chipset soldering onboard. Processor i7-3517UE plus Intel® QM77 chipset supports dual-core ULV 1.7 GHz, consuming only 17W and 4.1W individually. The powerful combination makes the SBC with high computing power for multi-tasking while reducing idle power consumption. Mission-critical applications can take the advantages of processors soldering onboard and extended operating temperature from -40 to 85°C to ensure ultimate durability, utmost resistance to shock & vibration. OXY5336A is truly a rugged SBC ideal for high-end Automation, heavy-duty railway, drilling and energy applications.

Thermal solution for fanless system design

Heat sinks are used to cool down device temperature by dissipating heat into surrounding air. Since the configurations and the power circuit placement of each model are different, which will lead to different extent of heat generation; therefore PERFECTRON designs tailor-made heat sink for each motherboard. Special high and low fin design forms a wind-flow to reduce thermal resistance. Moreover, cross section wave line on the interface increases up to 30-40% air contact area. Combining these two features, thermal performance leverages to utmost. The option of fan is also available to the customers if fanless design is not necessary.

Advanced cooling solution for better heat dissipation

To meet the demands of customer’s extended temperature requirements, the whole thermal solution of OXY5336A simultaneously embraces two heat transfer methods, heat conduction and heat convection. For heat conduction, the solution utilizes a copper heat spreader on the bottom layer which directly contact with the processor and chipset. Heat is then transferred to upper aluminum heat sink. Regarding to heat convection, the temperature differences caused by high and low fin design forms a mild airflow that could bring away heat efficiently. Fan can also be an auxiliary by placing an appropriate sized fan on top of the heat sink.