OXY5361A

Description

3.5″ SBC, Intel® Skylake U i7/i5/i3 CPU onboard, Extended Temperature. -40 to 85°C

• Support 6th Generation Intel® Core™ i7-6600U Processor
• 2 x SO-DIMM, supports Dual Channel DDR4 1866/2133 up to 32GB
• 1 x Full-size mPCIe, 1 x Half-size mPCIe
• Multi display: 2 x DisplayPort ; 1 x Dual Channel 24 Bit LVDS
• Dual LAN Ports ( Intel I210-IT & 1 x I219-LM GbE)
• 2 x COM Ports: 1 x RS-232, 1 x RS232/422/485
• 6 x USB Ports: 4 x USB 3.0, 2 x USB 2.0
• Wide rang 9~36V DC-in
• Extended operating temp. -40~+85°C

OXY5361A is a highly integrated 3.5″ rugged SBC driven by Intel® Skylake U SoC i7-6600U soldering onboard With processor soldered onboard can significantly enhance the resistance of vibration and shock. Processor supports graphics (HD Graphics 500 Series) and CPU performance and equips with rich legacy I/O features such as: 2 COM Ports; 8 Bit DIO; 6 USB Ports. With 2 DisplayPort and a Dual Channel 24 Bit LVDS, OXY5361A can fulfill diverse needs of modern day display & monitor control applications.OXY5361A can operate in harsh environment under temperature range from -40 to 85 °C and avoid damage from sudden surge of voltage with its 9V~36V DC input design.

Rich I/O interface – Extensive Functionality

Rich I/O design endows OXY5361A with the ability to comprehend present day automation devices, display, and other applications that require extensive I/O features. With 2 COM, 6 USB, 2 LAN, and dual Channel 24-bit LVDS, OXY5361A provides a wide array of choices to expand and connect to different devices.

Extended Temperature Operation

PERFECTRON aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5361A can operate from -40 up to 85 degree, our strict manufacture procedure guarantees supreme performance in severe environment.

Efficient thermal solution

A tailor-made heat spreader is what PERFECTRON provide for engineers to reduce mechanical design period also ensures the highest efficacy for dissipation. For OXY5361A, the customized heat sink is placed on top of the CPU and chipset, acting as the medium that exchanges the heat to the surrounding atmosphere. The highly efficient aluminum heat sink has a thermal conductivity to absorb the heat generated by the pumping CPU.