Description
6th/7th Gen Intel Core based Type VI Compact COM Express Module
Features
- 6th/7th generation Intel® Core™ processor family (formerly Skylake/Kaby Lake)
- Support DDR4-2133 non-ECC SODIMM up to 32GB
- Support VGA and LVDS for legacy applications
- Support Gen3 PCIe, SATA3, USB 3.0, OTG
- Support I2C, GPIO and SMBus
- Low profile solution with high performance and low power consumption
Designed with the 6th/7th generation Intel® Core™ processor family (formerly Skylake/Kaby Lake), the PCOM-B638VG features DDR4 memory support, Gen3 PCIe interface, and 30% faster graphic performance. Specifically, Gen3 PCIe supports greater PCIe performance, crucial for networking and medical applications. Also, the enhanced graphic feature supports 4K performance. The OTG support provides customer greater flexibility on developing applications to suit different usage environments.
| Specification | |
|---|---|
| Power Input Type | N/A |
| Processor | AMD Ryzen V-series |
| BIOS | AMI BIOS, UEFI Architecture |
| System Memory | Dual Channel DDR4 SO-DIMM Horizontal Socket (Up to 16GB) |
| Storage Device | 2x SATAIII |
| Watchdog Timer | Programmable via S/W from 1 sec ~ 255 min |
| Hareware Monitoring | I2C control |
| Expansion Interface | 1x PCIe x8 Interface from SoC chip 1x PCIe x4 Interface from SoC chip |
| Audio | High Definition Audio Interface |
| Ethernet | N/A |
| USB | 2x USB 2.0 4x USB 3.0 |
| Graphic Controller | AMD Radeon™ GFX9 with up to 11 compute units |
| Display Interface | 2x DDI Dual Displays Support (DP/eDP/LVDS/HDMI/VGA) |
| Dimensions | 125 mm x 95 mm (4.92" x 3.74") |
| Environment | Operating temperature: 0°C ~ 60°C with passive cooling Storage Temperature: -40°C ~ 85°C Operation Humidity: 5% ~ 95%, non-condensing RoHS compliant |
| MTBF | Over 120,000 hours at 40°C |
| EMI Certificate | CE, FCC Class B |
