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  • ROC335B

ROC335B

Intel® QM77 Fanless Rugged System with Intel® Ivy Bridge Core™ i7 Processor, 9V to 24V DC-in, Wide Temp. -40 to 70°C

Categories: Box PC, Compact Computers - Box PC, PERFECTRON
  • Description

Description

Intel® QM77 Fanless Rugged System with Intel® Ivy Bridge Core™ i7 Processor, 9V to 24V DC-in, Wide Temp. -40 to 70°C

 

With Intel® Ivy Bridge Core™ i7 Processor and Intel® QM77 chipset, the rugged computer ROC335B supports wide operating temp. -40 to 70°C and wide voltage input 9V to 24V DC-in. It has high performance in data & image managing. With its main features of 8 USB ports (4 x USB3.0, 4 x USB2.0), 5 COM ports (3 x RS232/422/485,2 x RS232), 2 x RJ45 Ethernet, and two in one 2.5″ HDD/SSD & CF-SATA socket, including its anti-vibration and corrosion resistance properties, make it is an ideal solution in Industrail Automation and Military type rugged applications.

Features:

  • Supports Intel® 22nm Ivy Bridge Processor (Mobile, rPGA988)
  • 2 x DDR3 SO-DIMM up to 16 GB
  • Supports 2.5″ SATA HDD/SSD & CF-SATA socket
  • 5 x COM ports (3 x RS232/422/485, 2 x RS232)
  • 4 x USB 3.0, 4 x USB 2.0
  • 1 x mini PCI_e
  • Dual GbE LAN ports
  • 9V ~ 24V DC-in
  • Wide temperature -40 to 70°C

Technical data:

Operating Temp.  -20°C ~ +50°C
System CPUIntel® Core™ Skylake-S

Intel® Core i3-6100TE (2C x 2.7 GHz), 4M Cache (35W)

Intel® Core i5-6500TE (4C x 2.3/3.3 GHz), 6M Cache (35W)

Intel® Core i7-6700TE (4C x 2.4/3.4 GHz), 8M Cache (35W)
ChipsetIntel® Q170 Chipset
GPUAMD E8860
Memory Type2 x DDR4 SO-DIMM up to 32 GB
Expansion Slot
1 x mPCIe with SIM card holder

Storage Device2 x 2.5" HDD/SSD trays
1 x M.2 (Type 2280) SSD
Ethernet ChipsetIntel® I211 & i219LM GbE
Front I/O Power Button1
Indicator LED1 x HDD LED
1 x Power LED
2.5" HDD/SSD Tray 2
Rear I/O Power Input1 x 4-pin Terminal Block
DisplayPort2 x DP++ connector (female), resolution up to 4096 x 2304@60 Hz
HDMI1 x HDMI1.4b connector (female), resolution up to 4096 x 2304@24 Hz
Ethernet2 x RJ45 ports
AudioMic-in, Line-out
COM2 x RS232

1 x RS-232/422/485 ports, select under BIOS (DB9 male)
Serial Signals
RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-

RS422: TX-, RX+, TX+, RX-, GND

RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND

RS485- 2W: DATA-, DATA+, GND
USB4 x USB 3.0
AudioMic-in, Line-out
DisplayDisplay InterfaceHDMI interface x 1:HDMI connectors (female); resolution up to 4096 x 2304@24 Hz
DisplayPort interface x 2: DP connectors (female); resolution up to 4096 x 2304@60 Hz
Graphics ControllerOnboard Intel® HD Graphics 500 Series
Graphic Card OutputAMD E8860: 6 x miniDisplayPort
NVIDIA M2000: 4 x DisplayPort
OS support list WindowsWindows 7 x32/ x64、Windows 8.1 x32/ x64、Windows 10 x32/ x64
LinuxFedora 15, Ubuntu, Red Hat
Mechanical and Environment
Power Requirement16V to 32V DC-in, AT/ATX
Dimension440 x 420 x 44 mm
Weight6.0 kg
Operating Temp.-20 to 50°C(ambient with air flow)
Storage Temp.-40 to 85°C
Relative Humidity5% to 95%, non-condensing
TEST STANDARD
MIL-STD-810G TestMethod 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMCCE, FCC compliant
Green ProductRoHS, WEEE compliance

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