Description
The TRICOR series embedded rugged computer combines a built-in touch screen available at various diagonals (8.4/10.4/12/15 inches & more) with excellent optical specifications; embedded with wide range of ultra low power Intel Embedded Processors based Single Board Computers (PIP3x Family). The features are flexible and can be chosen according to the application performance requirements with Quad Core i7 CPU Family, Memory, Storage, Display size (denoting as “X” in the TRICOR Model number), with EMI Protection, and other additional I/Os. All this comes within a small footprint of a standalone monitor / portable laptop, and therefore saves space. The special feature of the TRICOR is that it comes without a fan or air vents.
I/O Expansion
The TRICOR series has built in I/O expansion over mPCIe & PCIe-104 bus, allowing for additions of I/Os to meet future requirements.
Mounting Options
Generally the TRICOR will have wall mounting provisions given on rear side within the VESA* dimensions. Additional brackets may be designed according to the mounting requirements. (e.g. L-brackets for 19″ Rack mounting etc.).
Rugged Construction
The TRICOR model is constructed from military grade, high strength, and light weight HE30 grade aluminum alloy housing. Its modular architecture allows the system to be easily configurable with many options. The fanless design helps in noiseless operation, increases reliability, and gives the system a longer MTBF.
Key features are:
- CPU solution up to Quad Core i7
- Up to 16GB ECC DDR3 1600 Memory
- Universal selection of display (e.g. 12.1″ XGA Sun readable resistive touch screen display)
- Space for rugged 2.5″ SSD
- Quad Gigabit Ethernet (optional)
- Fan-less design
- Rugged & light weight
- Desk/Wall/Rack mountable
Środowisko | |
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Temperatura operacyjna | -20°C do +60°C, MIL-STD-810G, metoda 501,5 i 502,5 procedura-I i II |
Temperatura przechowywania | -40°C do +75°C, MIL-STD-810G, metoda 501,5 i 502,5 procedura-I i II |
Wstrząs funkcjonalny | 20G peak Saw Tooth @ 11ms, MIL-STD-810G, metoda 516.6 procedura-I |
Ochrona przed wypadkiem | 40G peak Saw Tooth @ 11ms MIL-STD-810G, metoda 516.6 procedura-V |
Transit Drop | 26 drops @ 122 cm wysokości, MIL-STD-810G, metoda 516.6 procedura-IV |
Wibracje | MIL-STD-810G, metoda 514.6 procedura-I, kategoria 13 Samoloty śmigłowe Losowa ekspozycja na wibracje |
Przyspieszenie - operacyjne | Fore - 2G | Rufowy - 6G | W górę - 9G | Dół - 3G | Lewy - 4G | Prawy - 4G, 1 min. @ Określony poziom „G”. MIL-STD-810G, metoda 513.6 procedura II |
Przyspieszenie - strukturalne | Fore - 3G | Rufa - 9G | W górę - 13,5G | Dół - 4,5G | Lewy - 6G | Z prawej - 6G MIL-STD-810G, metoda 513.6 procedura I |
Wysokość | 32808 stóp, MIL-STD-810G, metoda 500.5 procedura-I i procedura-II |
Szybka dekompresja | 8000 stóp do 347008 stóp w ciągu 12 sekund @ 10 minut MIL-STD-810G, metoda 500.5 procedura-III |
Wilgotność | 95% rh @ 10 cykli, MIL-STD-810G, metoda 507,5 procedura II |
Grzyb | MIL-STD-810G, metoda 508.6, procedura I |
Mgła solna | 4 cykle 2wet i 2dry, MIL-STD-810G, metoda 509.5, procedura I |
Kurz | LP5X Ochrona przed wnikaniem pyłu, IS-LEC60529-2001, tabela 7 i sekcja 13.4, 13.5 |
Woda | LPX4 Zabezpieczenie przed wnikaniem wody, IS-LEC60529-2001, tabela-8 i sekcja-14.2.4 |
EMI/RFI | MIL-STD-461E, CE102, RE102, CS101, CS114, CS115, CS116 i RS103 |
Model | OXY5135B-UT | |
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Mechanika i środowisko | Temperatura operacyjna | -40°C ~ +85°C |
System | Typ CPU | Intel® Core™ i7/i5/i3 procesor Core™ i7 3615QE (4C, 2.3GHz, 45W) Core™ i7 3612QE (4C, 2.1GHz, 35W) Core™ i7 3555LE (2C, 2.5GHz, 25W) Core™ i7 3517UE (2C, 1.7GHz, 17W) Core™ i5 3610ME (2C, 2.7GHz, 35W) Core™ i3 3120ME (2C, 2.4GHz, 35W) Core™ i3 3217UE (2C, 1.6GHz, 17W) |
Chipset | Intel® QM77 |
|
Typ pamięci | Dwukanałowy układ pamięci 4 GB DDR3 1600 MHz |
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BIOS | AMI® UEFI BIOS |
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Zegar nadzorujący | 1-255 sek. lub 1-255 min. programowalny software |
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Gniazdo rozszerzeń | Mini PCIe | 1 x PCIe x16 (2 x PCIe x8 lub 1 x PCIe x8 + 2 x PCIe x4) 7 x PCIe x1 |
Obraz | Chipset | Zintegrowany GFX w procesorze Ivy Bridge |
Rozdzielczość | maksymalna rozdzielczość 2048 x1536 | |
Typ obrazu | 3 porty DDI obsługują HDMI / DP / SDVO / DVI |
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Audio | Codec | Zintegrowany Intel® High Definition Audio |
Ethernet | Chipset | 1 x Intel® 82579LM GbE LAN |
Interfejs I / O | SATA | 2 x SATAIII (6 Gb/s) 2 x SATAII (3 Gb/s) |
USB | 4 x USB 3.0 8 x USB 2.0 |
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LPC bus | 1 | |
SMBus | 1 | |
I²C | 1 |