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  • SR100
SR100

SR100

Intel® QM87 MIL-STD Fanless Rugged System with Intel® Core™ i7 Haswell Processor, 9V to 36V DC-in, Wide Temp. -40 ~ 70°C

Categories: PERFECTRON, Rugged Computers, Rugged Computing Systems
  • Description

Description

Intel® QM87 MIL-STD Fanless Rugged System with Intel® Core™ i7 Haswell Processor, 9V to 36V DC-in, Wide Temp. -40 ~ 70°C

 

The SR100 based on Intel® Haswell QM87 chipset, is powered by Intel® 4th generation Core™ i7/i5/i3 processor onboard. The SR100 can operate effectively in harsh environment under temp range from -40 to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications.

SR100 is based on EBX form factor which features with stackable PCIe/104 and FPE expansions, on board Nano SATA(3.0)16/32 Giga Byte SSD and Swissbit XR-DIMM up to 8GB. It supports triple-display, 2 DP and 1 DVI-I, 2 GIGA LAN port, 4 USB 3.0, 1 COM port and 2 mPCIe Expansion slots (one co-layout with mSATA). SR100 supplies wide power voltage from 9 to 36V DC-in.

Technical features:

  • 4th Generation Intel® Core™ i7 Haswell processors (BGA)
  • XR-DIMM up to 8 GB RAM
  • Onboard uSSD SATAIII up to 64 GB
  • Multi-Displays by 2 x DP, 1 x DVI-I
  • 2 x mPCIe Expansion slot (One Co-Layout with mSATA)
  • 2 x PCIe Intel® Gigabit Ethernet
  • 4 x USB 3.0, 1 x COM ports
  • 9V~36V DC-in with power delay on/off
  • Extended Temperature -40 to 70 °C

Effective cooling solution for thermal design

STACKRACK implements unique cooling solution on SR100 to achieve maximum heat dissipation with copper heat spreader, pure copper heat pipe and aluminum heat sink. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source – processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR100 can ensure high reliability and stability while working under wide range temperature from -40 up to 70°C.

MIL-STD-810G standard designed for shock and vibration

SR100 is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. What’s more to make the system more rugged is SR100 designed with EBX form factor and stackable ability. With those two features can provide maximum exceeding solidity when stacking together to prevent loose from vibration. With key components- CPU and SSD soldering on board to enhance the capability of shock and vibration.

Stackable with PCIe/104 & FPE expansion

Known for application ruggedness, reliability, sealing properties, and compactness characteristics, PCIe/104 & FPE connectors are ideal for high-end electronic equipment and use in extreme environment conditions. With easy connect/disconnect and blind mating, SR100 has a functional life greater than 10,000 mating cycles. The PCIe/104 connector on SR100 that specifies standard of SAMTEC Q2™ QMS/QFS series in a three bank (156-pin) orientation for module stacking. SAMTEC designed the QMS/QFS series with a 15.24 mm stack height for top and bottom board stacking. And the Q2™ has triple the wipe of many high-speed mezzanine interconnects making SR100 the best choice for tough environmental conditions.

System main board: EBX SBC-OXY5737A

 

(1) Intel® Core i7 CPU soldering onboard

OXY5737A is based on EBX rugged single board computer, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard.With processor soldering on board can enhance the resistance of shock and vibration to allow product operates under every possible condition. With processor solder on board would lowerresistance and inductance at the connection enhance effective transmission that could guarantee better and more high frequency performance for the system.

(2) Expandable by Extension Storage Module, the SK401

SR100 carries stacking PCIe 104 and FPE expansion slot, which allows the system with optional module connects ability to increase a variety of possibility for device, connects. SR100 can use with stackable storage module SK401. With SK401 storage module stacking on board can additionally support 2x 2.5”SSD or HDD and 2x mSATA. The SK401 supports OS of Win 7, Win XP, Linux, DOS, etc.

(3) Wide range DC input from 9V~ 36V

For certain application such like transportation and military always challenge the risk of unstable power that might cause damage to the system. Wide range DC input becomes an indispensable element for those applications. SR100 supports Wide range 9V~ 36V DC-in to protect system from damage caused by sudden surge or peak voltage. This feature guarantees the system increasing migration path flexible and eliminates redesign of existing power architecture.

 

Operating Temp.-40°C ~ +70°C 
SystemCPUIntel® Core™ i7 Haswell , BGA type
Intel® Core i7-4700EQ (4C x 3.4/2.4 GHz GHz), 6M Cache (47W)
ChipsetIntel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type1 x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot2 x mPCIe (1 x colay with mSATA) for GEN2
Storage Device1 x mSATA up to 512GB
Ethernet Chipset2 x RJ45 : Intel® I210IT & i217LM GbE , 2 x M12 : Intel® I210IT
Front I/OPower Button1 with backlight
Power LED1
HDD LED1
LAN LED2 sets
USB2 x USB 3.0
Rear I/OPower Input1 x 4-pin X-code M12 connector
DisplayPort2 x 20-pin DP connector (female)
DVI-I1 x 29-pin DVI-D connector (female)
Ethernet2 x RJ45 ports
2 x 8-pin A-code M12 connector
AudioMic-in, Line-out
COM1x RS-232/422/485 ports, Jumper-selectable (DB9 male)
Serial Signals
RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-
RS422: TX-, RX+, TX+, RX-, GND
RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND
RS485- 2W: DATA-, DATA+, GND
USB2 x USB 3.0
DisplayDisplay InterfaceDVI-I interface x 1: 29-pin DVI-I connectors(female); resolution up to 1920 x 1200@60 Hz;
DisplayPort interface x 2: 20-pin display port connectors (female); resolution up to 3840 x 2160@60 Hz
Graphics ControllerOnboard Intel® HD 4600 graphics
OS support listWindowsWindows 7 x32/x64、Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64
LinuxFedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04
Mechanical and EnvironmentPower Requirement9V to 36V DC-in, AT/ATX mode with power delay on
Dimension262 x 149 x 76mm
Weight2.98 Kg (6.57 lbs)
Operating Temp.-40 to 70°C(ambient with air flow)
Storage Temp.-40 to 85°C
Relative Humidity5% to 95%, non-condensing
TEST STANDARDMIL-STD-810G TestMethod 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMCCE and FCC certificated
Green ProductRoHS, WEEE compliance

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