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SR10A

SR10A

Intel® QM87 MIL-STD Fanless Rugged Vibration Proof System with Intel® Core™ i7 Haswell Processor, mPCIe expansion 9V to 36V DC-in, Wide Temp. -40 ~ 70°C

Categories: PERFECTRON, Rugged Computers, Rugged Computing Systems
  • Description
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Description

Intel® QM87 MIL-STD Fanless Rugged Vibration Proof System with Intel® Core™ i7 Haswell Processor, mPCIe expansion 9V to 36V DC-in, Wide Temp. -40 ~ 70°C

The SR10A based on Intel® Haswell QM87 chipset, is powered by Intel® 4th generation Core™ i7/i5/i3 processor onboard. The SR10A can operate effectively in harsh environment under temp range from -40 to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR10A is based on EBX form factor, Swissbit XR-DIMM up to 8GB. It supports triple-display, 2 DP and 1 DVI-I, 2 GIGA LAN port, 4 USB 3.0 and 1 COM port. SR10A supplies wide power voltage from 9 to 36V DC-in.

Technical features:

  • 4th Generation Intel® Core™ i7 Haswell processors (BGA)
  • DDR3 Up to 8GB XR-DIMM
  • mSATA Up to 256GB
  • Multi-Displays by 2 x DP, 1 x DVI-I
  • 1 x mPCIe Expansion slot – 2 x PCIe Intel® Gigabit Ethernet
  • 4 x USB 3.0, 1 x COM ports (RS232/422/485)
  • 9V~36V DC-in with power delay on/off
  • Extended Temperature -40 to 70 °C
  • Optional unique accessory bumper design for vibration resistance

MIL-STD-810G standard designed for shock and vibration

SR10A is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. What’s more to make the system more rugged is SR10A designed with EBX form factor and stackable ability. With those two features can provide maximum exceeding solidity when stacking together to prevent loose from vibration. With key components- CPU and SSD soldering on board to enhance the capability of shock and vibration. With optional Bumper design, the level of vibration resistance increased.

Wire Rope Vibration Isolator Design for Higher Vibration Resistance

STACKRACK has especially design a Wire Rope Vibration Isolator for SR10A. The Wire Rope Vibration Isolator may sustain higher vibration resistance of the product itself. 

A Wire Rope Vibration Isolator is widely apply on supporting Military equipment because it may absorb and protect the object from vibration damage in any axes simultaneously, with the protection it may extended the product life operating under long hour vibration environment and vibration shock. The isolator is long life maintenance free tool and it may unload whenever required. Besides, Wipe Rope Vibration Isolators may survive under extreme temperature, corrosion, radioactivity, extreme dry or high humidity and UV Radiation environment.

System main board: EBX SBC-OXY5737A

 

(1) Intel® Core i7 CPU soldering onboard

OXY5737A is based on EBX rugged single board computer, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard. With processor soldering on board can enhance the resistance of shock and vibration to allow product operates under every possible condition. With processor solder on board would lower resistance and inductance at the connection enhance effective transmission that could guarantee better and more high frequency performance for the system.

(2) Expandable by Extension mPCIe x 2 slot

SR10A carries two mPCIe Slots, one co-lay with mSATA and one may for extra expansion.

(3) Wide range DC input from 9V~ 36V

For certain application such like transportation and military always challenge the risk of unstable power that might cause damage to the system. Wide range DC input becomes an indispensable element for those applications. SR10A supports Wide range 9V~ 36V DC-in to protect system from damage caused by sudden surge or peak voltage. This feature guarantees the system increasing migration path flexible and eliminates redesign of existing power architecture.

 

Operating Temp.-40°C ~ 70°C 
SystemCPUIntel® Core™ i7 Haswell , BGA type
Intel® Core i7-4700EQ (4C x 3.4/2.4 GHz), 6M Cache (47W)
ChipsetIntel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type1 x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot2 x mPCIe (1 x colay with mSATA) for GEN2
Storage Device64GB Onboard SSD
1 x mSATA
1 x 2.5" HDD/SSD
1 x SatckPC Slot
Front I/OPower ButtonWaterproof Power Button with LED backlight
Power Input1 x DC input (4-pin Rugged M12 connector)
X12 x USB2.0 (8-pin Rugged M12 connector)
X21 x GbE LAN (8-pin Rugged M12 connector)
X31 x GbE LAN (8-pin Rugged M12 connector)
X41 x VGA (12-pin Rugged M12 connector)
X51 x RS232, 1 x RS485 (12-pin Rugged M12 connector)
OS support listWindowsWindows 7 x32/x64、Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64
LinuxFedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04、Open SUSE 12.2
Mechanical and EnvironmentPower Requirement9V to 36V DC-in, AT/ATX mode supports
Dimension350 x 230 x 76 mm
Weight8.6 kg (18.9 lbs)
Operating Temp.-40 to 70°C(ambient with air flow)
Storage Temp.-40 to 85°C
Relative Humidity5% to 95%, non-condensing
TEST STANDARDMIL-STD-810G TestMethod 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMCCE and FCC compliance
MIL-STD 461F (With Optional Power Module)
Green ProductRoHS, WEEE compliance

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