Description
Intel® QM87 MIL-STD Fanless Rugged Vibration Proof System with Intel® Core™ i7 Haswell Processor, SSD easy swap cage, mPCIe expansion 9V to 36V DC-in, Wide Temp. -40 ~ 70°C
The SR10B based on Intel® Haswell QM87 chipset, is powered by Intel® 4th generation Core™ i7/i5/i3 processor onboard. The SR10B can operate effectively in harsh environment under temp range from -40 to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR10B is based on EBX form factor, Swissbit XR-DIMM up to 8GB. It supports triple-display, 2 DP and 1 DVI-I, 4 GIGA LAN port, 4 USB 3.0 and 4 COM port. SR10B supplies wide power voltage from 9 to 36V DC-in.
Technical features:
- 4th Generation Intel® Core™ i7 Haswell processors (BGA)
- DDR3 Up to 8GB XR-DIMM
- mSATA Up to 512GB
- Multi-Displays by 2 x DP, 1 x DVI-I
- 1 x mPCIe Expansion slot
- 4 x Intel® Gigabit Ethernet
- 4 x USB 3.0, 4 x COM ports (2x RS232/422/485, 2 x RS232)
- 9V~36V DC-in with power delay on/off
- Extended Temperature -40 to 70 °C
- Optional unique accessory bumper design for vibration resistance
MIL-STD-810G standard designed for shock and vibration
SR10B is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. What’s more to make the system more rugged is SR10B designed with EBX form factor and stackable ability. With those two features can provide maximum exceeding solidity when stacking together to prevent loose from vibration. With key components- CPU and SSD soldering on board to enhance the capability of shock and vibration. With unique Wipe Rope Vibration Isolator design, the level of vibration resistance increased.
Wire Rope Vibration Isolator Design for Higher Vibration Resistance
STACKRACK has especially design a Wire Rope Vibration Isolator for SR10B. The Wire Rope Vibration Isolator may sustain higher vibration resistance of the product itself. A Wire Rope Vibration Isolator is widely apply on supporting Military equipment because it may absorb and protect the object from vibration damage in any axes simultaneously, with the protection it may extended the product life operating under long hour vibration environment and vibration shock. The isolator is long life maintenance free tool and it may unload whenever required. Besides, Wipe Rope Vibration Isolators may survive under extreme temperature, corrosion, radioactivity, extreme dry or high humidity and UV Radiation environment.
System main board: EBX SBC-OXY5737A
(1) Intel® Core i7 CPU soldering onboard
OXY5737A is based on EBX rugged single board computer, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard. With processor soldering on board can enhance the resistance of shock and vibration to allow product operates under every possible condition. With processor solder on board would lower resistance and inductance at the connection enhance effective transmission that could guarantee better and more high frequency performance for the system.
(2) 2.5″ SATA Easy Storage Accessible Tray
Easy Storage Accessible Tray allow customer to access the Storage without disassemble the system. It may let the user remove, replace and carry out the HDD easily. With this feature, SR10 may widely apply in surveillance, data storage and infotainment purpose due to occasionally or daily storage reload is required.
(3) Wide range DC input from 9V~ 36V
For certain application such like transportation and military always challenge the risk of unstable power that might cause damage to the system. Wide range DC input becomes an indispensable element for those applications. SR10A supports Wide range 9V~ 36V DC-in to protect system from damage caused by sudden surge or peak voltage. This feature guarantees the system increasing migration path flexible and eliminates redesign of existing power architecture.
Model | OXY5535B-UT |
|
---|---|---|
Temperatura operacyjna | -40°C ~ +85°C |
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System | Typ CPU | Intel® Ivy Bridge, typ FCBGA1023 Core™ i3 3217UE (2C x 1.6GHz), 3M L2 cache (17W) Core™ i7 3517UE (2C x 1.7GHz), 4M L2 cashe (17W) Celeron 1047UE (1.4GHz), 2M L2 cache (17W) |
Chipset | Intel® QM77 |
|
Typ pamięci | 1 x DDR3 1333/1600 MHz XR-DIMM z ECC do 8 GB | |
BIOS | AMI® UEFI BIOS |
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Zegar nadzorujący | 1-255 sek. lub 1-255 min. programowalny software |
|
Gniazdo rozszerzeń | StackPC | 1 |
FPE | 1 | |
Obraz | Chipset | Zintegrowany GFX w procesorze Ivy Bridge |
VGA | 1 | |
DVI-D | 1 | |
LVDS | Dwukanałowy 24-bitowy LVDS |
|
Typ obrazu | VGA + LVDS |
|
Audio | Codec | Realtek ALC887 High Definition Audio Codec |
Ethernet | Chipset | Intel® 82579LM & 82574IT GbE |
Wewnętrzne I/O | SATA | 2 x SATAIII (6 Gb/s) |
Dysk flash NAND | Onbaord 32 GB MLC |
|
USB 2.0 | 4 | |
COM | 4 (2x RS232, 2x RS422/485) |
|
VGA | Złącze 1 na 1 x 10-stykowe (maks. Rozdzielczość SXGA 2048 x 1536 @ 60 Hz) |
|
LVDS | Złącze 1 na 1 x 30-stykowe |
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Inverter | Złącze 1 na 1 x 5-stykowe |
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DVI-D | Złącze 1 na 1 x 30-stykowe (maks. Rozdzielczość 1920 x 1080) |
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DIO | 8-bit (4 wejścia / 4 wyjścia bez izolacji) |
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PS/2 | Złącze 1 na 1 x 6-stykowe |
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FAN | 1 | |
Mechanika i środowisko | ||
Form Factor | PCIe/104 (StackPC) |
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Typ mocy | Wejście 12V DC, 4-stykowe złącze zasilania ATX, obsługa trybu AT / ATX |
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Wymiary | 95.89 x 115.57 mm (3.8" x 4.6") |
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Temperatura operacyjna | -40°C do 85°C |
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Temperatura przechowywania | -40°C do 85°C |
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Względna wilgotność | 10% do 90%, bez kondensacji |
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Testy zgodności | ||
Szok temperaturowy | MIL-STD-810G Metoda badawcza 503.5 Procedura szoku termicznego I-C / Przechowywanie (Szoki wielocyklowe od stałej ekstremalnej temperatury, od 85 ℃ do -40 ℃, trzy cykle) |
|
MIL-STD-810G | Wysoka temperatura | Metoda testowa MIL-STD-810G wysoka temperatura 501,5 (96 godzin przy 75 ℃ bez działania + 72 godziny przy 75 ℃ podczas pracy) |
Niska temperatura | MIL-STD-810G Metoda badawcza 502,5 Niska temperatura (96 godzin przy -40℃ bez działania +72 godziny przy -40℃ podczas pracy) |