LAUTERBACH ANNOUNCES THE LAUNCH OF THE POWERTRACE III AND MIXED-SIGNAL PROBE

Lauterbach GmbH launches new PowerTrace III and Mixed-Signal Probe to enhance customer debug experience

 

 

Lauterbach GmbH announces the launch of its new high-end trace tool, the PowerTrace III, accompanied by the new Mixed-Signal Probe, a high-performance hybrid tool to probe digital and analog signals. With this new tool set, Lauterbach again pushes the boundaries of the debug experience on microcontroller systems.

So far, the PowerTrace III is the best trace tool in Lauterbach’s portfolio. The long-lasting tool follows the product philosophy in terms of modularity and backward compatibility. It is architecture independent, expandable and futureproof.

 

 

Combined with one of the serial or parallel preprocessors, the PowerTrace III is designed to capture a CPU’s program-flow using off-chip trace interfaces like ETM, NEXUS and AGBT. The trace buffer of 8 GByte and the streaming speed of up to 400 MByte/s allows the collection of a large amount of data over a long period of time. The likelihood of memory overflow and thus the loss of data is considerably reduced.

The Mixed-Signal Probe is a hybrid probe capable of measuring up to 12 digital and 8 analog channels in parallel. Beside signal analysis, it provides the correlation of digital and analog signals with the program flow, supports energy profiling and includes protocol analysis functions. The Mixed-Signal Probe is included in the PowerTrace III set, but it can be ordered separately to be used in combination with other Lauterbach trace tools: the CombiProbe 2 and the µTrace.

 

 

Says Norbert Weiss, Managing Director of Lauterbach GmbH, “The company has always been committed to making modular tools that allow developers to re-use as much as possible when switching to new projects. The PowerTrace III does that and provides a significant improvement in the amount of trace data that our customers can capture to analyze and measure their embedded designs. Every few years, the embedded designs undergo a step change in their power and capabilities and the tools need to be able to grow alongside this. I firmly believe that, once again, we have the right tools to ensure the success of our customers.”

Both products will be available from the first of April 2021 on.