Measuring only 75 x 75mm, the ADLE3900SEC is the second generation embedded SBC optimized for size, weight and power (SWAP) applications. Based on the Intel Atom™ SoC E3900 series, this tiny board offers maximum performance in the smallest possible size. It features up to quad-core x 86 processors with 2MB cache and an integrated Intel HD graphics 505 engine of the 9th generation with support for DirectX 12, Open GL 4.4, OpenCL 2.0 and hardware-accelerated UHD video playback with H.265/HEVC, VC-1, WMV9 and VP9.
About the ADL Edge-Connect Architecture:
The rear edge connector provides easy access to additional I/Os for standard and custom breakout boards. This simple expansion helps to reduce cabling, integration time and system size, while increasing quality and overall MTBF. Connection to sensors, cameras and memories is easy with a variety of onboard I/Os: 2x Gigabit LAN, 1x USB 3.0, 1x USB 2.0, 2x PCie and SATA. The Intel HD graphics engine outputs video via the DisplayPort (optionally via adapter also HDMI/DVI). An integrated M.2 socket enables the user to install the fastest solid state storage solutions on the market. The fix mounted edge-connect design coupled with soldered-on memory makes the ADLE3900SEC ideal for rugged embedded applications in extended temperature range as well as shock and vibration.
UAV and UUV Unmanned Systems, Industrial Control Systems, Government and Defense, Video Surveillance, Small Scale Robotics, Remote Datalogging, Man-Wearable Computing
- CPU: Intel® Atom™ E3900 Processor (Apollo Lake)
- CPU Choice: Quad Core (x7-E3950), Dual Core (x5-E3930)
- Chipset: Intel® SoC
- RAM: Up to 8GB LPDDR4 soldered
|ADLE3900SEC-E3930-4||tbd.||Intel x5-E3930 Atom Processor; Dual Core, 2x 1.3 GHz, 2MB Cache, 6,5W TDP, 4GB RAM soldered|
|ADLE3900SEC-E3950-8||tbd.||Intel x7-E3950 Atom Processor; Quad Core, 4x 1.6GHz, 2MB Cache, 12W TDP, 8GB RAM soldered|
|ADLE3900SEC-Spreader||tbd.||Low-Profile E3900SEC Heat Spreader|
|ADL-ET||290000||Extended Temperature Screening (–40C to +85C)|
|UNDERFILL||807707||BGA underfill req’d for <1nm BGA solderballs w/ Ext Temp|
|UNDERFILL/BONDING/COATING||807709||Underfilling, Bonding, and Conformal Coating|