THE FANLESS EMBEDDED XEON SERVER FROM MPL

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Rugged Fanless Xeon Server Solution with up to 16 Cores

 

 

The fanless embedded Xeon server from MPL AG enables to use a powerful server in rugged applications. The solution is available in a fanless MIL enclosure or open frame to be built into existing housings. The concept offers substantially more processing power, more memory capacity, more flexibility (M-COTS), than any fanless solutions in the past.

The MXCS (MPL Xeon Class Server) has been designed with the same design philosophy as in the past 34 yeas of designing rugged fanless MPL products. The concept “Rugged by Design” has been applied, and results in a Server solution with highlights like:

  • Fanless design;
  • Use of components in extended temperature;
  • Use of components out of embedded program with longterm availability;
  • Designed to meet most rugged requirements.

Just to mention a few design highlights.

The design of the Xeon server solution is such that the system is conductive cooled. This fact allows the operation of the system even in the extended temperature range from -40°C up to +60°C. The conductive cooling concept can be adjusted to the actual application and location of installation.

The MXCS is modular and therefore extremely flexible and can be used in any rugged application. It can be used with an enclosure as shown for wall or desktop mounting, as 19″ rack, depending on the internal expansions and adjusted cooling mechanism.

The MXCS is, as all other MPL products, SWaP-C (Size, Weight, Power and Cooling) oriented and requires less than 60W in full operation. The unit comes with several internal buses for expansions (M-COTS). The MXCS comes with features like:

  • 4 x mSATA or M.2 for mass storage;
  • 4 x mPCIe slots with retention capabilities;
  • 4 x PCIe x1 or 1 x PCIe x8 and 1 x PCIe x1;
  • Expansion capabilities for GPGPU on MXM, PCIe (eg. RAID, high end graphics or XMC modules);
  • Up to 128GB registered ECC DDR4 memory;
  • BMC for remote management (IPMI);
  • Redundant Boot Flash;
  • Optional TPM module, with Intel chip or FPGA.

The MXCS is the perfect solution for an unlimited range of application like C4ISR, EW, imaging processing, surveillance, virtual machines, data center processing or any application that requires most processing power in a small space without the need of a fan and highest reliability.

The MXCS is 100% designed and produced by MPL AG in Switzerland. The Solution is designed to meet standards like CE, UL, MIL-STD-810G, MIL-STD-461F, MIL-STD-704F, MIL-STD-1275D, CE, EN 50155 or IEC 60945. The MXCS conforms to most standards, like all other proven Embedded Computer and Networking products from MPL AG, supplied for the past 34 years.