Opis
Operating Temp. |
|
---|---|
UT : -40°C to 85°C | |
System |
|
CPU Type | Intel® Ivy Bridge 22nm Core™ i7/i5/i3, BGA type
Core™ i7-3517UE (2C x 1.7 GHz), 4M L2 cache (17W) |
Chipset | Intel® HM76 |
Memory Type | 1 x 204-pin SO-DIMM DDR3 1333/1600 MHz up to 8GB |
BIOS | AMI® UEFI BIOS |
Super I/O | Fintek F81866AD-I |
Expansion Slot |
|
Mini PCIe | 1 x miniPCIe for Gen2 |
mSATA | 1 x mSATA for Gen2 |
Display |
|
Chipset | Intel® HD Grapics 4000 Integrated Graphics Engine |
VGA | Yes (Max. resolution 2048 x 1536) |
LVDS | Dual channel 24-bit LVDS(Max. resolution 1920 x 1080 @ 60Hz) |
Display Type | VGA, LVDS, DVI-I |
Audio |
|
Codec | Realtek ALC887 High Definition Audio Codec |
Ethernet |
|
Chipset | Intel® 82579LM & 82574L GbE (support 10/100/1000 Mbps for 2 x RJ45 ports) |
WOL | Yes |
Boot from LAN | Yes for PXE |
Rear I/O |
|
VGA | 1 x 15-pin VGA connector (female) |
DVI-I | 1 x 29-pin DVI-I connector (female) |
Ethernet | 2 x RJ45 ports (support 10/100/1000 Mbps for2 x RJ45 ports) |
COM | 1 x RS232/422/485 with 5V/12V selectable |
Serial Signals
RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS- RS422: TX-, RX+, TX+, RX-, GND RS485: DATA-, DATA+, GND |
|
USB | 2 x USB 3.0 |
Internal I/O |
|
SATA | 2 x SATAIII (6 Gb/s) |
USB | 8 x USB 2.0 ports by 2 x 5-pin header |
COM | 3 x COM ports
COM1、3、4 ports support RS232 only with 5V/12V selectable by 1×10-pin header |
Audio | Mic-in, Line-in, Line-out |
LVDS | 30-pin connector |
FAN | 1 x CPU fan |
PS/2 | 1 x 8-pin header |
Parellel Port | 2 x 13-pin header |
DIO | 8-bit (4 in/4 out) |
SIM card holder | 1 |
OS support list |
|
Windows | Windows7 32bit、Windows7 64bit |
Linux | Ubuntu 13.10、Ubuntu 14.04 |
Mechanical and Environment |
|
Form Factor | 3.5″ SBC |
Power Type | 12V DC-in, 4-pin ATX power connector, AT/ATX mode support |
Dimension | 146 x 102 mm (5.7″ x 4″) |
Operating Temp. | UT : -40°C to 85°C |
Storage Temp. | -40°C to 85°C |
Relative Humidity | 10% to 90%, non-condensing |
Test Standard |
|
MIL-STD-810G | |
Temperature Shock | MIL-STD-810G Test Method 503.5 Temperature Shock Procedure I-C / Storage (Multi-cycle shocks from constant extreme temperature, Form 85℃ to -40℃, Three cycle) |
High Temperature | MIL-STD-810G Test Method 501.5 high Temp ( 96 hours @75℃ non-operating + 72 hours @ 75℃ operating ) |
Low Temperature | MIL-STD-810G Test Method 502.5 Low Temp ( 96 hours @ -40℃ non-operating +72 hours @ -40℃ operating ) |
Ordering Information
OXY5336A-ET-3517UE 3.5″ SBC Intel® Ivy Bridge Processor (Mobile) BGA CPU,
Multi-Display by DVI-I, VGA, LVDS, Dual Intel® GbE LAN, +12V DC-in (Core™ i7-3517UE) (-20 to 70°C)
OXY5336A-ET-3610ME 3.5″ SBC Intel® Ivy Bridge Processor (Mobile) BGA CPU,
Multi-Display by DVI-I, VGA, LVDS, Dual Intel® GbE LAN, +12V DC-in (Core™ i5-3610ME) (-20 to 70°C)
OXY5336A-ET-3217UE 3.5″ SBC Intel® Ivy Bridge Processor (Mobile) BGA CPU,
Multi-Display by DVI-I, VGA, LVDS, Dual Intel® GbE LAN, +12V DC-in(Core™ i3-3217UE ) (-20 to 70°C)
OXY5336A-UT-3517UE 3.5″ SBC Intel® Ivy Bridge Processor (Mobile) BGA CPU,
Multi-Display by DVI-I, VGA, LVDS, Dual Intel® GbE LAN, +12V DC-in (Core™ i7-3517UE) (-40 to 85°C optional)
OXY5336A-UT-3610ME 3.5″ SBC Intel® Ivy Bridge Processor (Mobile) BGA CPU,
Multi-Display by DVI-I, VGA, LVDS, Dual Intel® GbE LAN, +12V DC-in (Core™ i5-3610ME) (-40 to 85°C optional)
OXY5336A-UT-3217UE 3.5″ SBC Intel® Ivy Bridge Processor (Mobile) BGA CPU,
Multi-Display by DVI-I, VGA, LVDS, Dual Intel® GbE LAN, +12V DC-in (Core™ i3-3217UE) (-40 to 85°C optional)
Cable Kit
Cable kit for OXY5336A
Thermal Kit
Active heatsink(up to 60°C)
Copper heat spreader
Passive heatsink(up to 75°C)