Opis
System typu „rugged” bez wentylatora Intel® QM77 z procesorem Intel® Ivy Bridge Core™ i7, szerokim zakresem DC-in (9V do 24V) oraz wysoką tolerancją temperatury (-40 do 70°C)
ROC335B, komputer typu „rugged”, z procesorem Intel® Ivy Bridge Core™ i7 i chipsetem Intel® QM77 obsługuje szeroki zakres temperatur pracy (-40 do 70°C) i szeroki zakres DC-in (od 9V do 24V). Ma wysoką wydajność w zarządzaniu danymi i obrazami. 8 portów USB (4 x USB 3.0, 4 x USB 2.0), 5 portów COM (3 x RS232/422/485, 2 x RS232), 2 x RJ45 Ethernet i dwa gniazda w jednym 2.5″ HDD/SSD i CF-SATA, właściwości antywibracyjne i odporność na korozję – wszystko to sprawia, że ROC335B stanowi idealne rozwiązanie w zastosowaniach przemysłowych i wojskowych.
Cechy szczególne:
- Procesor Intel® 22nm Ivy Bridge (Mobile, rPGA988)
- 2 x DDR3 SO-DIMM do 16 GB
- Gniazdo 2,5″ SATA HDD/SSD i CF-SATA
- 5 x porty COM (3 x RS232/422/485, 2 x RS232)
- 4 x USB 3.0, 4 x USB 2.0
- 1 x mini PCI_e
- Dwa porty LAN GbE
- 9V ~ 24V DC-in
- Szeroki zakres temperatur pracy: -40 do 70°C
Dane techniczne:
| Operating Temp. | -20°C ~ +50°C |
|
|---|---|---|
| System | CPU | Intel® Core™ Skylake-S Intel® Core i3-6100TE (2C x 2.7 GHz), 4M Cache (35W) Intel® Core i5-6500TE (4C x 2.3/3.3 GHz), 6M Cache (35W) Intel® Core i7-6700TE (4C x 2.4/3.4 GHz), 8M Cache (35W) |
| Chipset | Intel® Q170 Chipset | |
| GPU | AMD E8860 | |
| Memory Type | 2 x DDR4 SO-DIMM up to 32 GB |
|
| Expansion Slot | 1 x mPCIe with SIM card holder |
|
| Storage Device | 2 x 2.5" HDD/SSD trays 1 x M.2 (Type 2280) SSD |
|
| Ethernet Chipset | Intel® I211 & i219LM GbE |
|
| Front I/O | Power Button | 1 |
| Indicator LED | 1 x HDD LED 1 x Power LED |
|
| 2.5" HDD/SSD Tray | 2 | |
| Rear I/O | Power Input | 1 x 4-pin Terminal Block |
| DisplayPort | 2 x DP++ connector (female), resolution up to 4096 x 2304@60 Hz |
|
| HDMI | 1 x HDMI1.4b connector (female), resolution up to 4096 x 2304@24 Hz |
|
| Ethernet | 2 x RJ45 ports |
|
| Audio | Mic-in, Line-out |
|
| COM | 2 x RS232 1 x RS-232/422/485 ports, select under BIOS (DB9 male) |
|
| Serial Signals |
||
| RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS- RS422: TX-, RX+, TX+, RX-, GND RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND RS485- 2W: DATA-, DATA+, GND |
||
| USB | 4 x USB 3.0 |
|
| Audio | Mic-in, Line-out |
|
| Display | Display Interface | HDMI interface x 1:HDMI connectors (female); resolution up to 4096 x 2304@24 Hz DisplayPort interface x 2: DP connectors (female); resolution up to 4096 x 2304@60 Hz |
| Graphics Controller | Onboard Intel® HD Graphics 500 Series | |
| Graphic Card Output | AMD E8860: 6 x miniDisplayPort NVIDIA M2000: 4 x DisplayPort |
|
| OS support list | Windows | Windows 7 x32/ x64、Windows 8.1 x32/ x64、Windows 10 x32/ x64 |
| Linux | Fedora 15, Ubuntu, Red Hat |
|
| Mechanical and Environment | Power Requirement | 16V to 32V DC-in, AT/ATX |
| Dimension | 440 x 420 x 44 mm |
|
| Weight | 6.0 kg |
|
| Operating Temp. | -20 to 50°C(ambient with air flow) |
|
| Storage Temp. | -40 to 85°C |
|
| Relative Humidity | 5% to 95%, non-condensing |
|
| TEST STANDARD | MIL-STD-810G Test | Method 507.5, Procedure II (Temperature & Humidity) Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6 Shock-Procedure I Operating (Mechanical Shock) Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration) Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) |
| EMC | CE, FCC compliant |
|
| Green Product | RoHS, WEEE compliance |
