Opis
Intel® Ivy Bridge Q77 Mini-ITX Industrial MB, rozszerzona temperatura (od -40°C do 85°C)
INS8346B to płyta główna Mini ITX, oparta na chipsecie Intel® Q77 Express i zaprojektowana dla nowych 22nm procesorów Intel® Core ™ trzeciej generacji w gnieździe LGA1155. INS8346B jest modelem cechującym się wysoką klasą w stosunku do aplikacji przemysłowych, takich jak serwer pamięci, POS, kiosk, medycyna, gry, cyfrowe oznakowanie i monitorowanie bezpieczeństwa nadzoru.
Dane techniczne
- Obsługuje procesor Intel® LGA 1155 Core ™ i7/i5/i3
- 2 x DDR3 SO-DIMM do 16 GB
- Multi-display: VGA, DVI-D, LVDS, HDMI
- 1 x PCIe x16
- 1 x mPCIe
- 1 x mSATA
- 8 portów USB
- 6 x porty COM
- 16-bit DIO
Model | AB20 | |
---|---|---|
Mechanical and Environment | Operating Temp. | -40°C ~ +85°C |
System | CPU Type | Intel® LGA1151 Core i7 / i5 / i3 Processor Core™ i7-6700 3.4 GHz (8M Cache, 65W) Core™ i5-6500 3.2 GHz (6M Cache, 65W) Core™ i7-6700TE 2.4 GHz (8M Cache, 35W) Core™ i5-6500TE 2.3 GHz (6M Cache, 35W) |
Chipset | Intel® Q170 | |
Memory Type | 4 x Dual channel DDR4 XR-DIMM up to 64GB | |
Watchdog | 1-255 sec. or 1-255 min. software programmable |
|
Expansion Slot | Golden Finger | 1 x PCIe x 16 Golden Finger |
Mini-PCIe | 4 x mPCIe (2 with mSATA supported) | |
MXM Slot | 1 x MXM slot support MXM3.0/3.1 | |
Display | Chipset | Intel® HD Graphics 500 Series |
Display Type | DisplayPort, HDMI, VGA | |
Audio | Codec | Realtek ALC888 High Definition Audio Codec |
Ethernet | Chipset | Intel® I210-IT & I219-LM GbE LAN |
Rear I/O | DisplayPort | 7 (1 from CPU, 6 From MXM) |
HDMI | 1 | |
Ethernet | 4 x RJ45 |
|
USB | 4 x USB3.0 |
|
Internal I/O | SATA | 6 x SATAIII (6Gb/s, reserve space) |
COM | 6 (2 x RS232/422/485, 4 x RS232) |
|
USB | 2 x USB3.0, 4 x USB2.0 |
|
VGA | CPU/System fan connectors | |
Audio | Line-in, Line-out, Mic | |
DIO | 16-bit (8 in/8 out) | |
Fan | 1 x CPU Fan, 1 x System Fan, 1 x MXM Fan | |
Power Requirements | Input Voltage | 12V DC (2 x 4-pin terminal block) |
OS support list | Windows | Windows 7 x32/x64、Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64 |
Linux | Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04 | |
Mechanical and Environment | ||
Form Factor | ATX | |
Power type | 12 V DC, tryb AT/ATX |
|
Dimension | 305 x 244 mm (12" x 9.6") | |
Operating Temp. | -40°C to 85°C |
|
Storage Temp. | -40°C to 85°C | |
Relative Humidity | 10% do 90%, non-condensing | |
TEST STANDARD | ||
MIL-STD-810G Test | Method 507.5, Procedure II (Temperature & Humidity) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5 Temperature Shock Procedure I-C / Storage (Multi-cycle shocks from constant extreme temperature, Form 85℃ to -40℃, Three cycle) (Temperature shock) |